Issued Patents All Time
Showing 26–50 of 81 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10109605 | Polymer layers embedded with metal pads for heat dissipation | Hao-Hsiang Chuang, Ching-Feng Yang, Kai-Chiang Wu, Hao-Yi Tsai, Chuei-Tang Wang +1 more | 2018-10-23 |
| 10079200 | Packaging devices and methods | Kai-Chiang Wu, Ming-Che Ho, Yi-Wen Wu | 2018-09-18 |
| 10062654 | Semicondcutor structure and semiconductor manufacturing process thereof | Yu-Chia Lai, Chen-Hua Yu, Chang-Pin Huang, Chung-Shi Liu, Hsien-Ming Tu +3 more | 2018-08-28 |
| 10049990 | Solder ball protection in packages | Chia-Chun Miao, Kai-Chiang Wu | 2018-08-14 |
| 10037959 | Semiconductor structure and manufacturing method thereof | Chia-Chun Miao, Yen-Ping Wang, Kai-Chiang Wu, Ming-Kai Liu | 2018-07-31 |
| 9978704 | Semiconductor devices with ball strength improvement | Tsung-Yuan Yu, Hsien-Wei Chen, Ying-Ju Chen | 2018-05-22 |
| 9966321 | Methods and apparatus for package with interposers | Chun-Lin Lu, Kai-Chiang Wu, Yen-Ping Wang, Ching-Feng Yang | 2018-05-08 |
| 9953966 | Semiconductor device and method of forming the same | Chia-Chun Miao, Kai-Chiang Wu, Yen-Ping Wang | 2018-04-24 |
| 9953942 | Semiconductor packaging and manufacturing method thereof | Chao-Wen Shih, Kai-Chiang Wu, Ching-Feng Yang, Ming-Kai Liu, Yen-Ping Wang | 2018-04-24 |
| 9943239 | Optical sensing system and associated electronic device | Hung-Yi Kuo, Hao-Yi Tsai, Hsien-Ming Tu, Chang-Pin Huang, Chih-Hua Chen +2 more | 2018-04-17 |
| 9941240 | Semiconductor chip scale package and manufacturing method thereof | Ming-Kai Liu, Chun-Lin Lu, Kai-Chiang Wu, Ching-Feng Yang, Yen-Ping Wang +1 more | 2018-04-10 |
| 9852985 | Conductive terminal on integrated circuit | Yu-Chia Lai, Chen-Hua Yu, Chang-Pin Huang, Chung-Shi Liu, Hsien-Ming Tu +3 more | 2017-12-26 |
| 9806045 | Interconnection structure including a metal post encapsulated by solder joint having a concave outer surface | Chun-Lin Lu, Kai-Chiang Wu, Ming-Kai Liu, Yen-Ping Wang, Ching-Feng Yang +2 more | 2017-10-31 |
| 9799615 | Package structures having height-adjusted molding members and methods of forming the same | Chang-Pin Huang, Chung-Shi Liu, Hsien-Ming Tu, Hung-Yi Kuo, Hao-Yi Tsai +2 more | 2017-10-24 |
| 9786618 | Semiconductor structure and manufacturing method thereof | Chang-Pin Huang, Hsien-Ming Tu, Ching-Jung Yang, Hung-Yi Kuo, Yu-Chia Lai +3 more | 2017-10-10 |
| 9748212 | Shadow pad for post-passivation interconnect structures | Bor-Rung Su, Chang-Pin Huang, Chien-Chia Chiu, Hsien-Ming Tu, Chun-Hung Lin +1 more | 2017-08-29 |
| 9741659 | Electrical connections for chip scale packaging | Hsien-Wei Chen | 2017-08-22 |
| 9698079 | Barrier structures between external electrical connectors | Chia-Chun Miao, Kai-Chiang Wu | 2017-07-04 |
| 9653418 | Packaging devices and methods | Kai-Chiang Wu, Ming-Che Ho, Yi-Wen Wu | 2017-05-16 |
| 9653341 | Semiconductor structure and manufacturing method thereof | Chia-Chun Miao, Chao-Wen Shih, Ching-Feng Yang | 2017-05-16 |
| 9646954 | Integrated circuit with test circuit | Yu-Wen Liu, Hsien-Wei Chen | 2017-05-09 |
| 9640498 | Integrated fan-out (InFO) package structures and methods of forming same | Chang-Pin Huang, Chen-Hua Yu, Ching-Jung Yang, Chung-Shi Liu, Hsien-Ming Tu +3 more | 2017-05-02 |
| 9627325 | Package alignment structure and method of forming same | Ming-Kai Liu, Chia-Chun Miao, Kai-Chiang Wu, Ching-Feng Yang, Yen-Ping Wang +1 more | 2017-04-18 |
| 9627332 | Integrated circuit structure and seal ring structure | Hsien-Ming Tu, Ching-Jung Yang, Chang-Pin Huang, Yu-Chia Lai | 2017-04-18 |
| 9559071 | Mechanisms for forming hybrid bonding structures with elongated bumps | Chun-Lin Lu, Kai-Chiang Wu, Ming-Kai Liu, Yen-Ping Wang, Ching-Feng Yang +2 more | 2017-01-31 |