Issued Patents All Time
Showing 76–81 of 81 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8692378 | UBM structures for wafer level chip scale packaging | Tsung-Yuan Yu, Hsien-Wei Chen, Ying-Ju Chen | 2014-04-08 |
| 8664768 | Interposer having a defined through via pattern | Kai-Chiang Wu, Ming-Kai Liu, Chia-Chun Miao, Chun-Lin Lu | 2014-03-04 |
| 8624359 | Wafer level chip scale package and method of manufacturing the same | Chung-Ying Yang, Hsien-Wei Chen, Tsung-Yuan Yu | 2014-01-07 |
| 8618827 | Measurement of electrical and mechanical characteristics of low-K dielectric in a semiconductor device | Tung-Liang Shao, Ying-Ju Chen, Ching-Jung Yang, Hsien-Wei Chen, Hao-Yi Tsai +2 more | 2013-12-31 |
| 8581400 | Post-passivation interconnect structure | Hsien-Wei Chen, Ying-Ju Chen, Tsung-Yuan Yu, Mirng-Ji Lii | 2013-11-12 |
| 8237160 | Probe pad on a corner stress relief region in a semiconductor chip | Hsien-Wei Chen, Chung-Ying Yang, Ying-Ju Chen, Ching-Jung Yang | 2012-08-07 |