Issued Patents All Time
Showing 51–75 of 136 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10157859 | Semiconductor device structure | Shou-Zen Chang, Chi-Ming Huang, Kai-Chiang Wu, Sen-Kuei Hsu, Hsin-Yu Pan +1 more | 2018-12-18 |
| 9978656 | Mechanisms for forming fine-pitch copper bump structures | Tsung-Shu Lin, Ming-Da Cheng, Chang-Chia Huang, Hao-Juin Liu | 2018-05-22 |
| 9899982 | On-chip electromagnetic bandgap (EBG) structure for noise suppression | Ming-Hsien Tsai, Chien-Min Lin, Fu-Lung Hsueh, Sa-Lly Liu, Sen-Kuei Hsu | 2018-02-20 |
| 9875972 | Semiconductor device structure and method for forming the same | Shou-Zen Chang, Chi-Ming Huang, Kai-Chiang Wu, Sen-Kuei Hsu, Hsin-Yu Pan +1 more | 2018-01-23 |
| 9859266 | Method of forming 3D integrated circuit package with panel type lid | Tsung-Ding Wang, Kim Hong Chen, Jung Wei Cheng, Chien Ling Hwang, Hsin-Yu Pan | 2018-01-02 |
| 9780046 | Seal rings structures in semiconductor device interconnect layers and methods of forming the same | Hsin-Yu Pan, Pei-Haw Tsao, Yu-Chen Hsu | 2017-10-03 |
| 9673184 | Packages with molding material forming steps | Yu-Chen Hsu, Chun-Hung Lin, Yu-Feng Chen | 2017-06-06 |
| 9666530 | Semiconductor device | Chen-Shien Chen, Yu-Chih Huang, Yu-Feng Chen, Kuo Lung Pan, Yu-Jen Cheng +2 more | 2017-05-30 |
| 9653406 | Conductive traces in semiconductor devices and methods of forming same | Chao-Wen Shih, Chen-Hua Yu, Hsin-Yu Pan, Hao-Yi Tsai, Sen-Kuei Hsu | 2017-05-16 |
| 9620414 | Protecting flip-chip package using pre-applied fillet | Tsung-Fu Tsai, Yian-Liang Kuo, Ming-Song Sheu, Yu-Ling Tsai, Chen-Shien Chen | 2017-04-11 |
| 9553065 | Bumps for chip scale packaging including under bump metal structures with different diameters | Chun-Hung Lin, Yu-Feng Chen, Tsung-Shu Lin, Hsien-Wei Chen | 2017-01-24 |
| 9502383 | 3D integrated circuit package processing with panel type lid | Tsung-Ding Wang, Kim Hong Chen, Jung Wei Cheng, Chien Ling Hwang, Hsin-Yu Pan | 2016-11-22 |
| 9502360 | Stress compensation layer for 3D packaging | Chun-Hung Lin, Yu-Feng Chen, Hung-Jui Kuo | 2016-11-22 |
| 9472524 | Copper-containing layer on under-bump metallization layer | Yu-Feng Chen, Chun-Hung Lin, Chih-Hang Tung, Kai-Chiang Wu, Ming-Che Ho | 2016-10-18 |
| 9418956 | Zero stand-off bonding system and method | Chun-Hung Lin, Ming-Che Ho, Yu-Feng Chen, Yi-Wen Wu, Hsien-Liang Meng | 2016-08-16 |
| 9418947 | Mechanisms for forming connectors with a molding compound for package on package | Yu-Feng Chen, Chun-Hung Lin, Ming-Da Cheng, Kai-Chiang Wu | 2016-08-16 |
| 9406634 | Package structure and method of forming the same | Yuh Chern Shieh, Yu-Feng Chen, Tin-Hao Kuo | 2016-08-02 |
| 9355928 | Package-on-package structure | Yu-Feng Chen, Chun-Hung Lin, Chun-Cheng Lin, Ming-Da Cheng, Kai-Chiang Wu | 2016-05-31 |
| 9293404 | Pre-applying supporting materials between bonded package components | Yu-Chen Hsu, Yu-Feng Chen, Meng-Tse Chen, Guan-Yu Chen | 2016-03-22 |
| 9159686 | Crack stopper on under-bump metallization layer | Yu-Feng Chen, Chun-Hung Lin, Chih-Hang Tung, Kai-Chiang Wu, Ming-Che Ho | 2015-10-13 |
| 9064880 | Zero stand-off bonding system and method | Chun-Hung Lin, Ming-Che Ho, Yu-Feng Chen, Yi-Wen Wu, Hsien-Liang Meng | 2015-06-23 |
| 9064881 | Protecting flip-chip package using pre-applied fillet | Tsung-Fu Tsai, Yian-Liang Kuo, Ming-Song Sheu, Yu-Ling Tsai, Chen-Shien Chen | 2015-06-23 |
| 9041223 | Bump-on-trace (BOT) structures | Yuh Chern Shieh, Yu-Feng Chen, Tin-Hao Kuo | 2015-05-26 |
| 8970033 | Extending metal traces in bump-on-trace structures | Yu-Feng Chen, Yuh Chern Shieh, Tsung-Shu Lin, Jiun Yi Wu, Tin-Hao Kuo | 2015-03-03 |
| 8970024 | Packages with molding material forming steps | Yu-Chen Hsu, Chun-Hung Lin, Yu-Feng Chen | 2015-03-03 |