Issued Patents All Time
Showing 101–125 of 136 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7485496 | Semiconductor device package with a heat sink and method for fabricating the same | Kun-Sheng Chien, Shih-Kuang Chiu, Cheng-Hsu Hsiao | 2009-02-03 |
| 7274088 | Flip-chip semiconductor package with lead frame as chip carrier and fabrication method thereof | Chi-Chuan Wu, Chien-Ping Huang | 2007-09-25 |
| 7247934 | Multi-chip semiconductor package | — | 2007-07-24 |
| 7208825 | Stacked semiconductor packages | Chien-Ping Huang | 2007-04-24 |
| 7199459 | Semiconductor package without bonding wires and fabrication method thereof | Chien-Ping Huang | 2007-04-03 |
| 7196414 | Semiconductor package with heat sink | Chang-Fu Lin, Cheng-Hsu Hsiao, Chien-Ping Huang | 2007-03-27 |
| 7177155 | Semiconductor package with heat sink | Chang-Fu Lin, Cheng-Hsu Hsiao, Chien-Ping Huang | 2007-02-13 |
| 7102239 | Chip carrier for semiconductor chip | Chang-Fu Lin, Chien-Ping Huang | 2006-09-05 |
| 7057405 | Wafer test method utilizing conductive interposer | — | 2006-06-06 |
| 7057276 | Semiconductor package with heat sink | Chang-Fu Lin, Chien-Ping Huang | 2006-06-06 |
| 7023085 | Semiconductor package structure with reduced parasite capacitance and method of fabricating the same | — | 2006-04-04 |
| 6980438 | Semiconductor package with heat dissipating structure | Chien-Ping Huang, Chin-Te Chen, Chang-Fu Lin | 2005-12-27 |
| 6943439 | Substrate and fabrication method of the same | Chien-Ping Huang, Chih-Chin Liao | 2005-09-13 |
| 6891273 | Semiconductor package and fabrication method thereof | Chien-Ping Huang | 2005-05-10 |
| 6849942 | Semiconductor package with heat sink attached to substrate | Chang-Fu Lin, Cheng-Hsu Hsiao, Chien-Ping Huang | 2005-02-01 |
| 6830957 | Method of fabricating BGA packages | Chien-Ping Huang, Chih-Ming Huang | 2004-12-14 |
| 6828665 | Module device of stacked semiconductor packages and method for fabricating the same | Chih-Ming Huang, Chien-Ping Huang | 2004-12-07 |
| 6787918 | Substrate structure of flip chip package | Ying-Chou Tsai, Shih-Kuang Chiu | 2004-09-07 |
| 6689636 | Semiconductor device and fabrication method of the same | Chih-Chin Liao, Chien-Ping Huang | 2004-02-10 |
| 6646349 | Ball grid array semiconductor package | Chien-Ping Huang | 2003-11-11 |
| 6621150 | Lead frame adaptable to the trend of IC packaging | Yvonne Lee, Chien-Ping Huang | 2003-09-16 |
| 6610560 | Chip-on-chip based multi-chip module with molded underfill and method of fabricating the same | Yu-Po Wang, Caesar Lin | 2003-08-26 |
| 6593662 | Stacked-die package structure | Randy H. Y. Lo, Tzong-Dar Her, Chien-Ping Huang, Cheng-Shiu Hsiao, Chi-Chuan Wu | 2003-07-15 |
| 6580618 | Low-profile multi-chip module | — | 2003-06-17 |
| 6570249 | Semiconductor package | Chih-Chin Liao, Chien-Ping Huang | 2003-05-27 |