Issued Patents All Time
Showing 126–136 of 136 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6555924 | Semiconductor package with flash preventing mechanism and fabrication method thereof | Ting-Ke Chai, Po Yuan | 2003-04-29 |
| 6498054 | Method of underfilling a flip-chip semiconductor device | Shih-Kuang Chiu, Ying-Chou Tsai | 2002-12-24 |
| 6469897 | Cavity-down tape ball grid array package assembly with grounded heat sink and method of fabricating the same | Tzong-Da Ho, Chien-Ping Huang | 2002-10-22 |
| 6459144 | Flip chip semiconductor package | Shih-Kuang Chiu, Keng-Yuan Liao, Chien-Ping Huang | 2002-10-01 |
| 6451625 | Method of fabricating a flip-chip ball-grid-array package with molded underfill | Tzong-Da Ho | 2002-09-17 |
| 6400036 | Flip-chip package structure and method of fabricating the same | Wei-Sen Tang | 2002-06-04 |
| 6350669 | Method of bonding ball grid array package to circuit board without causing package collapse | Chien-Ping Huang | 2002-02-26 |
| 6321976 | Method of wire bonding for small clearance | Randy H. Y. Lo, Tony T Yuan | 2001-11-27 |
| 6291264 | Flip-chip package structure and method of fabricating the same | Wei-Sen Tang | 2001-09-18 |
| 6281578 | Multi-chip module package structure | Randy H. Y. Lo, Chi-Chuan Wu, Eric Ko | 2001-08-28 |
| 6184573 | Chip packaging | — | 2001-02-06 |