Issued Patents All Time
Showing 76–100 of 136 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8927333 | Die carrier for package on package assembly | Tsung-Shu Lin, Yu-Ling Tsai | 2015-01-06 |
| 8759964 | Wafer level package structure and fabrication methods | Mirng-Ji Lii | 2014-06-24 |
| 8680663 | Methods and apparatus for package on package devices with reduced strain | Yu-Feng Chen | 2014-03-25 |
| 8420521 | Method for fabricating stack structure of semiconductor packages | Fang-Lin Tsai, Ho-Yi Tsai, Cheng-Hsu Hsiao | 2013-04-16 |
| 8420452 | Fabrication method of leadframe-based semiconductor package | Chien-Ping Huang | 2013-04-16 |
| 8400178 | Method and system of testing a semiconductor device | Mill-Jer Wang | 2013-03-19 |
| 8373282 | Wafer level chip scale package with reduced stress on solder balls | Yu-Feng Chen, Yu-Ling Tsai, Hung-Jui Kuo, Yu Yi Huang | 2013-02-12 |
| 8288871 | Reduced-stress bump-on-trace (BOT) structures | Yuh Chern Shieh, Yu-Feng Chen, Tin-Hao Kuo | 2012-10-16 |
| 8183092 | Method of fabricating stacked semiconductor structure | Chien-Ping Huang, Chih-Ming Huang, Yu-Po Wang, Cheng-Hsu Hsiao | 2012-05-22 |
| 8058100 | Method for fabricating chip scale package structure with metal pads exposed from an encapsulant | Chien-Ping Huang, Cheng-Hsu Hsiao | 2011-11-15 |
| 7993967 | Semiconductor package fabrication method | Yih-Jenn Jiang, Chien-Ping Huang, Cheng-Hsu Hsiao | 2011-08-09 |
| 7932601 | Enhanced copper posts for wafer level chip scale packaging | Kuo-Chin Chang, Pei-Haw Tsao | 2011-04-26 |
| 7888236 | Semiconductor device and fabrication methods thereof | Bai-Yao Lou, Dean Wang, Ching-Wen Hsiao, Kai-Ming Ching, Chen-Cheng Kuo +3 more | 2011-02-15 |
| 7871860 | Method of semiconductor packaging | Tsung-Shu Lin, Chen-Shien Chen | 2011-01-18 |
| 7855443 | Stack structure of semiconductor packages and method for fabricating the stack structure | Fang-Lin Tsai, Ho-Yi Tsai, Cheng-Hsu Hsiao | 2010-12-21 |
| 7820543 | Enhanced copper posts for wafer level chip scale packaging | Kuo-Chin Chang, Pei-Haw Tsao | 2010-10-26 |
| 7781264 | Method for fabricating flip-chip semiconductor package with lead frame as chip carrier | Chi-Chuan Wu, Chien-Ping Huang | 2010-08-24 |
| 7772685 | Stacked semiconductor structure and fabrication method thereof | Chien-Ping Huang, Chih-Ming Huang, Yu-Po Wang, Cheng-Hsu Hsiao | 2010-08-10 |
| 7759170 | Fabrication method of semiconductor package having heat dissipation device | Chien-Ping Huang, Cheng-Hsu Hsiao | 2010-07-20 |
| 7750467 | Chip scale package structure with metal pads exposed from an encapsulant | Chien-Ping Huang, Cheng-Hsu Hsiao | 2010-07-06 |
| 7679178 | Semiconductor package on which a semiconductor device can be stacked and fabrication method thereof | Chien-Ping Huang, Chih-Ming Huang, Yu-Po Wang, Cheng-Hsu Hsiao | 2010-03-16 |
| 7671466 | Semiconductor package having heat dissipating device with cooling fluid | Chien-Ping Huang, Cheng-Hsu Hsiao | 2010-03-02 |
| 7666716 | Fabrication method of semiconductor package | Cheng-Hsu Hsiao | 2010-02-23 |
| 7638879 | Semiconductor package and fabrication method thereof | Yih-Jenn Jiang, Chien-Ping Huang, Cheng-Hsu Hsiao | 2009-12-29 |
| 7489044 | Semiconductor package and fabrication method thereof | Cheng-Hsu Hsiao | 2009-02-10 |