Issued Patents All Time
Showing 26–50 of 136 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11127708 | Package structure and method of manufacturing the same | Ming-Kai Liu, Ting-Chu Ko, Yung-Ping Chiang, Chang-Wen Huang, Yu-Sheng Hsieh | 2021-09-21 |
| 11075159 | Integrated fan-out packages and methods of forming the same | Ching-Yu Huang, Ming-Kai Liu, Ting-Chu Ko, Yung-Ping Chiang, Chang-Wen Huang +1 more | 2021-07-27 |
| 11004810 | Semiconductor package structure | Kai-Chiang Wu, Chun-Lin Lu, Chao-Wen Shih, Nan-Chin Chuang | 2021-05-11 |
| 10937734 | Conductive traces in semiconductor devices and methods of forming same | Chao-Wen Shih, Chen-Hua Yu, Hsin-Yu Pan, Hao-Yi Tsai, Sen-Kuei Hsu | 2021-03-02 |
| 10879197 | Package structure and method of fabricating package structure | Albert Wan, Chung-Shi Liu, Chao-Wen Shih, Chien Ling Hwang | 2020-12-29 |
| 10879170 | Semiconductor package and manufacturing method thereof | Yung-Ping Chiang, Chung-Shi Liu, Ming-Kai Liu, Ting-Chu Ko, Chang-Wen Huang +2 more | 2020-12-29 |
| 10872842 | Semiconductor device and manufacturing method thereof | Albert Wan, Chen-Hua Yu, Chung-Shi Liu, Chao-Wen Shih, Hsin-Yu Pan +1 more | 2020-12-22 |
| 10867930 | Integrated fan-out packaging | Hsiao-Wen Lee | 2020-12-15 |
| 10867882 | Semiconductor package, semiconductor device and method for packaging semiconductor device | Albert Wan, Chao-Wen Shih, Hsin-Yu Pan, Sen-Kuei Hsu | 2020-12-15 |
| 10825773 | Package structure with reinforcement structures in a redistribution circuit structure and method of manufacturing the same | Chen-Hua Yu, Chun-Lin Lu, Kai-Chiang Wu | 2020-11-03 |
| 10756052 | Method of manufacturing integrated fan-out package | Albert Wan, Ching-Hua Hsieh, Chung-Hao Tsai, Chuei-Tang Wang, Chao-Wen Shih +5 more | 2020-08-25 |
| 10748861 | Package structure and manufacturing method thereof | Kai-Chiang Wu, Yen-Ping Wang | 2020-08-18 |
| 10741508 | Semiconductor device having antenna and manufacturing method thereof | Albert Wan, Ching-Hua Hsieh, Chao-Wen Shih, Meng-Tse Chen, Sheng-Hsiang Chiu | 2020-08-11 |
| 10629540 | Semiconductor device and method | Chen-Hua Yu, Hui-Jung Tsai, Hung-Jui Kuo, Chung-Shi Liu, Ting-Chu Ko | 2020-04-21 |
| 10553561 | Mechanisms of forming connectors for package on package | Yu-Feng Chen, Chun-Hung Lin, Ming-Da Cheng, Kai-Chiang Wu | 2020-02-04 |
| 10553533 | Integrated fan-out package and manufacturing method thereof | Chun-Lin Lu, Kai-Chiang Wu, Nan-Chin Chuang | 2020-02-04 |
| 10529698 | Semiconductor packages and methods of forming same | Chen-Hua Yu, Der-Chyang Yeh | 2020-01-07 |
| 10510693 | Semiconductor package structure | Kai-Chiang Wu, Chun-Lin Lu, Chao-Wen Shih, Nan-Chin Chuang | 2019-12-17 |
| 10504865 | Package structure and method of manufacturing the same | Ming-Kai Liu, Ting-Chu Ko, Yung-Ping Chiang, Chang-Wen Huang, Yu-Sheng Hsieh | 2019-12-10 |
| 10490479 | Packaging of semiconductor device with antenna and heat spreader | Albert Wan, Chao-Wen Shih, Hsin-Yu Pan, Sen-Kuei Hsu | 2019-11-26 |
| 10381309 | Package structure having connecting module | Chuei-Tang Wang, Chung-Hao Tsai, Chen-Hua Yu, Chun-Lin Lu, Chao-Wen Shih +2 more | 2019-08-13 |
| 10366966 | Method of manufacturing integrated fan-out package | Albert Wan, Ching-Hua Hsieh, Chung-Hao Tsai, Chuei-Tang Wang, Chao-Wen Shih +5 more | 2019-07-30 |
| 10366971 | Pre-applying supporting materials between bonded package components | Yu-Chen Hsu, Yu-Feng Chen, Meng-Tse Chen, Guan-Yu Chen | 2019-07-30 |
| 10269720 | Integrated fan-out packaging | Hsiao-Wen Lee | 2019-04-23 |
| 10256203 | Semiconductor device and semiconductor package | Lipu Kris Chuang, Hsin-Yu Pan, Sen-Kuei Hsu | 2019-04-09 |