Issued Patents All Time
Showing 76–100 of 132 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510693 | Semiconductor package structure | Kai-Chiang Wu, Chun-Lin Lu, Han-Ping Pu, Nan-Chin Chuang | 2019-12-17 |
| 10510652 | Method of manufacturing semiconductor device | Tsung-Yuan Yu, Hao-Yi Tsai, Hung-Yi Kuo, Pi-Lan Chang | 2019-12-17 |
| 10490479 | Packaging of semiconductor device with antenna and heat spreader | Albert Wan, Han-Ping Pu, Hsin-Yu Pan, Sen-Kuei Hsu | 2019-11-26 |
| 10483617 | Package structure | Nan-Chin Chuang, Chen-Hua Yu, Chung-Shi Liu, Shou-Zen Chang | 2019-11-19 |
| 10475757 | Package structure and manufacturing method thereof | Albert Wan, Shou-Zen Chang, Nan-Chin Chuang | 2019-11-12 |
| 10381309 | Package structure having connecting module | Chuei-Tang Wang, Chung-Hao Tsai, Chen-Hua Yu, Chun-Lin Lu, Han-Ping Pu +2 more | 2019-08-13 |
| 10366966 | Method of manufacturing integrated fan-out package | Albert Wan, Ching-Hua Hsieh, Chung-Hao Tsai, Chuei-Tang Wang, Han-Ping Pu +5 more | 2019-07-30 |
| 10354964 | Integrated devices in semiconductor packages and methods of forming same | Chen-Hua Yu, Kai-Chiang Wu, Chung-Shi Liu, Shou-Zen Chang | 2019-07-16 |
| 10327995 | Automatic medicine retrieving device | Yu-Ting Wang, King-Lung Huang, PANG-YEN JAO | 2019-06-25 |
| 10319692 | Semiconductor structure and manufacturing method thereof | Yung-Ping Chiang, Hao-Yi Tsai, Mirng-Ji Lii | 2019-06-11 |
| 10312209 | Manufacturing method of semiconductor package | Kai-Chiang Wu, Ching-Feng Yang, Ming-Kai Liu, Shih-Wei Liang, Yen-Ping Wang | 2019-06-04 |
| 10312203 | Structure and formation method of chip package with antenna element | Yung-Ping Chiang, Nien-Fang Wu, Min-Chien Hsiao, Yi-Che Chiang, Shou-Zen Chang +2 more | 2019-06-04 |
| 10276920 | Package structure, electronic device and method of fabricating package structure | Min-Chien Hsiao, Chen-Hua Yu, Chung-Shi Liu, Shou-Zen Chang | 2019-04-30 |
| 10269904 | Semiconductor structure and manufacturing method thereof | Chen-Hua Yu, Mirng-Ji Lii, Hung-Yi Kuo, Hao-Yi Tsai, Tsung-Yuan Yu +1 more | 2019-04-23 |
| 10183858 | Semiconductor structure and method of manufacturing the same | Albert Wan, Yu-Sheng Hsieh, Shou-Zen Chang, Chung-Shi Liu, Chen-Hua Yu | 2019-01-22 |
| 10186492 | Package structure and manufacturing method thereof | Albert Wan, Shou-Zen Chang, Nan-Chin Chuang | 2019-01-22 |
| 10157807 | Sensor packages and manufacturing mehtods thereof | Yung-Ping Chiang, Shou-Zen Chang, Albert Wan, Yu-Sheng Hsieh | 2018-12-18 |
| 9953942 | Semiconductor packaging and manufacturing method thereof | Kai-Chiang Wu, Ching-Feng Yang, Ming-Kai Liu, Shih-Wei Liang, Yen-Ping Wang | 2018-04-24 |
| 9728477 | Method of manufacturing a semiconductor device having scribe lines | Nien-Fang Wu, Yung-Ping Chiang, Hao-Yi Tsai | 2017-08-08 |
| 9653406 | Conductive traces in semiconductor devices and methods of forming same | Chen-Hua Yu, Han-Ping Pu, Hsin-Yu Pan, Hao-Yi Tsai, Sen-Kuei Hsu | 2017-05-16 |
| 9653341 | Semiconductor structure and manufacturing method thereof | Chia-Chun Miao, Shih-Wei Liang, Ching-Feng Yang | 2017-05-16 |
| 9589915 | Semiconductor device and manufacturing method thereof | Tsung-Yuan Yu, Hao-Yi Tsai, Wen-Hsin Chan, Chen-Chih Hsieh | 2017-03-07 |
| 9543263 | Semiconductor packaging and manufacturing method thereof | Kai-Chiang Wu, Ching-Feng Yang, Ming-Kai Liu, Shih-Wei Liang, Yen-Ping Wang | 2017-01-10 |
| 9543259 | Semiconductor structure with oval shaped conductor | Yung-Ping Chiang, Hao-Yi Tsai, Mirng-Ji Lii | 2017-01-10 |
| 9530759 | 3D package with through substrate vias | Chen-Hua Yu, Mirng-Ji Lii, Hung-Yi Kuo, Hao-Yi Tsai, Tsung-Yuan Yu +1 more | 2016-12-27 |