Issued Patents All Time
Showing 101–125 of 132 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9484308 | Semiconductor device | Ming-Kai Liu, Yung-Ping Chiang | 2016-11-01 |
| 9437490 | Semiconductor device and manufacturing method thereof | Tsung-Yuan Yu, Hao-Yi Tsai, Hung-Yi Kuo, Pi-Lan Chang | 2016-09-06 |
| 9431360 | Semiconductor structure and manufacturing method thereof | Hsuan-Ting Kuo, Yu-Peng Tsai, Wei-Hung Lin, Chun-Lung Jao, Ming-Da Cheng +1 more | 2016-08-30 |
| 9397056 | Semiconductor device having trench adjacent to receiving area and method of forming the same | Yen-Ping Wang, Yung-Ping Chiang, Shih-Wei Liang, Tsung-Yuan Yu, Hao-Yi Tsai +2 more | 2016-07-19 |
| 9379076 | Semiconductor device and manufacturing method thereof | Chen-Chih Hsieh, Hao-Yi Tsai, Yung-Ping Chiang, Tsung-Yuan Yu | 2016-06-28 |
| 9343385 | Semiconductor device comprising a chip substrate, a mold, and a buffer layer | Nien-Fang Wu, Yung-Ping Chiang, Hao-Yi Tsai | 2016-05-17 |
| 9343415 | Copper post structure for wafer level chip scale package | Yung-Ping Chiang, Chen-Chih Hsieh, Hao-Yi Tsai | 2016-05-17 |
| 9333653 | Automatic pill grasping apparatus and method | SZU-HAI HUANG, Kuo-Ming Lai, PEI-YI CHAN, JENG-CHE CHEN, TUI-CHIEN WU +3 more | 2016-05-10 |
| 9305877 | 3D package with through substrate vias | Chen-Hua Yu, Mirng-Ji Lii, Hung-Yi Kuo, Hao-Yi Tsai, Tsung-Yuan Yu +1 more | 2016-04-05 |
| 9284111 | Automatic pill grasping apparatus | SZU-HAI HUANG, Kuo-Ming Lai, PEI-YI CHAN, JENG-CHE CHEN, TUI-CHIEN WU +3 more | 2016-03-15 |
| 9236322 | Methods and apparatus for heat spreader on silicon | Hsien-Wei Chen, Chung-Ying Yang, Kai-Chiang Wu | 2016-01-12 |
| 9035468 | Copper post structure for wafer level chip scale package | Yung-Ping Chiang, Chen-Chih Hsieh, Hao-Yi Tsai | 2015-05-19 |
| 8865521 | 3D semiconductor package interposer with die cavity | Shin-Puu Jeng, Kim Hong Chen, Shang-Yun Hou, Cheng-Chieh Hsieh, Chen-Hua Yu | 2014-10-21 |
| 8810025 | Reinforcement structure for flip-chip packaging | Yu-Wen Liu, Ching-Jung Yang, Hsien-Wei Chen, Hsin-Yu Pan | 2014-08-19 |
| 8669651 | Package-on-package structures with reduced bump bridging | Chung-Ying Yang, Hao-Yi Tsai, Hsien-Wei Chen, Mirng-Ji Lii, Tzuan-Horng Liu | 2014-03-11 |
| 8519537 | 3D semiconductor package interposer with die cavity | Shin-Puu Jeng, Kim Hong Chen, Shang-Yun Hou, Cheng-Chieh Hsieh, Chen-Hua Yu | 2013-08-27 |
| 8283781 | Semiconductor device having pad structure with stress buffer layer | Wei-Cheng Wu, Shang-Yun Hou, Shin-Puu Jeng, Tzuan-Horng Liu, Tzu-Wei Chiu | 2012-10-09 |
| 8158891 | Circuit board structure and method for manufacturing the same | — | 2012-04-17 |
| 8070932 | Circuit board with identifiable information and method for fabricating the same | Shih-Ping Hsu, Shang-Wei Chen, Suo-Hsia Tang | 2011-12-06 |
| 8022530 | Package substrate having electrically connecting structure | — | 2011-09-20 |
| 7964801 | Circuit board structure and fabrication method thereof | — | 2011-06-21 |
| 7948085 | Circuit board structure | Zhao-Chong Zeng | 2011-05-24 |
| 7719853 | Electrically connecting terminal structure of circuit board and manufacturing method thereof | — | 2010-05-18 |
| 7659193 | Conductive structures for electrically conductive pads of circuit board and fabrication method thereof | Wen-Hung Hu, Ying-Tung Wang, Shih-Ping Hsu | 2010-02-09 |
| 7553750 | Method for fabricating electrical conductive structure of circuit board | — | 2009-06-30 |