Issued Patents All Time
Showing 126–132 of 132 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7546682 | Methods for repairing circuit board having defective pre-soldering bump | Shih-Ping Hsu | 2009-06-16 |
| 7419897 | Method of fabricating circuit board having different electrical connection structures | — | 2008-09-02 |
| 7365272 | Circuit board with identifiable information and method for fabricating the same | Shih-Ping Hsu, Shang-Wei Chen, Suo-Hsia Tang | 2008-04-29 |
| 7350298 | Method for fabricating circuit board with conductive structure | Shih-Ping Hsu, Sao-Hsia Tang, Ying-Tung Wang, Wen-Hung Hu | 2008-04-01 |
| 7341934 | Method for fabricating conductive bump of circuit board | Shih-Ping Hsu, Sao-Hsia Tang, Ying-Tung Wang, Wen-Hung Hu, Meng-Da Chou | 2008-03-11 |
| 7174630 | Method for fabricating connection terminal of circuit board | Shih-Ping Hsu, Sao-Hsia Tang | 2007-02-13 |
| 7151050 | Method for fabricating electrical connection structure of circuit board | Shih-Ping Hsu, Sao-Hsia Tang, Ying-Tung Wang, Wen-Hung Hu | 2006-12-19 |