Issued Patents All Time
Showing 26–50 of 94 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10559546 | Package on package structure and method for forming the same | Chen-Hua Yu, Chung-Shi Liu, Ming-Da Cheng, Mirng-Ji Lii, Wei-Hung Lin | 2020-02-11 |
| 10522452 | Packaging methods for semiconductor devices including forming trenches in workpiece to separate adjacent packaging substrates | Kuei-Wei Huang, Wei-Hung Lin, Chih-Wei Lin, Chun-Cheng Lin, Ming-Da Cheng +1 more | 2019-12-31 |
| 10513070 | Wafer level transfer molding and apparatus for performing the same | Bor-Ping Jang, Yeong-Jyh Lin, Chien Ling Hwang, Chung-Shi Liu, Ming-Da Cheng +1 more | 2019-12-24 |
| 10510709 | Semicondcutor package and manufacturing method thereof | Ching-Hua Hsieh, Chung-Shi Liu, Chih-Wei Lin | 2019-12-17 |
| 10510719 | Methods of packaging semiconductor devices and packaged semiconductor devices | Chen-Hua Yu, Chung-Shi Liu, Hui-Min Huang, Chih-Fan Huang, Ming-Da Cheng | 2019-12-17 |
| 10504858 | Package structure and method of fabricating the same | Ching-Hua Hsieh, Chung-Shi Liu, Chih-Wei Lin, Hao-Cheng Hou, Jung Wei Cheng | 2019-12-10 |
| 10490539 | Package on-package structure including a thermal isolation material and method of forming the same | Kuei-Wei Huang, Tsai-Tsung Tsai, Ai-Tee Ang, Ming-Da Cheng, Chung-Shi Liu | 2019-11-26 |
| 10468355 | EMI Shielding structure in InFO package | Kai-Chiang Wu, Chen-Hua Yu, Ching-Feng Yang | 2019-11-05 |
| 10468377 | Device package including molding compound having non-planar top surface around a die | Chen-Hua Yu, Ming-Da Cheng, Chung-Shi Liu | 2019-11-05 |
| 10366971 | Pre-applying supporting materials between bonded package components | Yu-Chen Hsu, Yu-Feng Chen, Han-Ping Pu, Guan-Yu Chen | 2019-07-30 |
| 10325883 | Package-on-package structure and method | Sheng-Hsiang Chiu, Ching-Hua Hsieh, Chung-Shi Liu, Sheng-Feng Weng, Ming-Da Cheng | 2019-06-18 |
| 10283470 | Semiconductor package and manufacturing method thereof | Chih-Wei Lin, Shing-Chao Chen, Ching-Hua Hsieh, Chen-Hua Yu, Chung-Shi Liu +2 more | 2019-05-07 |
| 10283377 | Integrated fan-out package and manufacturing method thereof | Ching-Hua Hsieh, Chung-Shi Liu, Chih-Wei Lin, Sheng-Hsiang Chiu, Yao-Tong Lai | 2019-05-07 |
| 10276541 | 3D package structure and methods of forming same | Chung-Shi Liu, Chih-Wei Lin, Hui-Min Huang, Hsuan-Ting Kuo, Ming-Da Cheng | 2019-04-30 |
| 10269763 | Package-on-package structure having polymer-based material for warpage control | Yu-Chih Liu, Hui-Min Huang, Wei-Hung Lin, Jing Ruei Lu, Ming-Da Cheng +1 more | 2019-04-23 |
| 10192804 | Bump-on-trace packaging structure and method for forming the same | Wei-Hung Lin, Chih-Wei Lin, Kuei-Wei Huang, Hui-Min Huang, Ming-Da Cheng +1 more | 2019-01-29 |
| 10177104 | Package on package structure and method for forming the same | Chen-Hua Yu, Chung-Shi Liu, Ming-Da Cheng, Mirng-Ji Lii, Wei-Hung Lin | 2019-01-08 |
| 10153180 | Semiconductor bonding structures and methods | Hsiu-Jen Lin, Wei-Hung Lin, Kuei-Wei Huang, Ming-Da Cheng, Chung-Shi Liu | 2018-12-11 |
| 10134703 | Package on-package process for applying molding compound | Wei-Hung Lin, Sheng-Yu Wu, Bor-Ping Jang, Ming-Da Cheng, Chung-Shi Liu +6 more | 2018-11-20 |
| 10043778 | Methods of packaging semiconductor devices and packaged semiconductor devices | Chen-Hua Yu, Chung-Shi Liu, Hui-Min Huang, Chih-Fan Huang, Ming-Da Cheng | 2018-08-07 |
| 10020211 | Wafer-level molding chase design | Chen-Hua Yu, Chung-Shi Liu, Hui-Min Huang, Chih-Fan Huang, Ming-Da Cheng +2 more | 2018-07-10 |
| 9947552 | Structure and formation method of chip package with fan-out structure | Shing-Chao Chen, Chih-Wei Lin, Hui-Min Huang, Ming-Da Cheng, Kuo Lung Pan +3 more | 2018-04-17 |
| 9881888 | Manufacturing method of interconnect structure | Hsiu-Jen Lin, Chih-Wei Lin, Ming-Da Cheng, Chih-Hang Tung, Chung-Shi Liu | 2018-01-30 |
| 9859229 | Package structure and method for forming the same | Yu-Peng Tsai, Sheng-Feng Weng, Sheng-Hsiang Chiu, Chih-Wei Lin, Wei-Hung Lin +3 more | 2018-01-02 |
| 9847317 | Methods of packaging semiconductor devices and packaged semiconductor devices | Chen-Hua Yu, Chung-Shi Liu, Hui-Min Huang, Chih-Fan Huang, Ming-Da Cheng | 2017-12-19 |