Issued Patents All Time
Showing 51–75 of 94 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9818729 | Package-on-package structure and method | Sheng-Hsiang Chiu, Ching-Hua Hsieh, Chung-Shi Liu, Sheng-Feng Weng, Ming-Da Cheng | 2017-11-14 |
| 9802349 | Wafer level transfer molding and apparatus for performing the same | Bor-Ping Jang, Yeong-Jyh Lin, Chien Ling Hwang, Chung-Shi Liu, Ming-Da Cheng +1 more | 2017-10-31 |
| 9786631 | Device package with reduced thickness and method for forming same | Chen-Hua Yu, Ming-Da Cheng, Chung-Shi Liu | 2017-10-10 |
| 9768137 | Stud bump structure for semiconductor package assemblies | Hsiu-Jen Lin, Chih-Wei Lin, Cheng-Ting Chen, Ming-Da Cheng, Chung-Shi Liu | 2017-09-19 |
| 9711470 | Package on package structure and method for forming the same | Chen-Hua Yu, Chung-Shi Liu, Ming-Da Cheng, Mirng-Ji Lii, Wei-Hung Lin | 2017-07-18 |
| 9691726 | Methods for forming fan-out package structure | Ming-Da Cheng, Hsien-Wei Chen, Cheng-Lin Huang, Chung-Shi Liu | 2017-06-27 |
| 9679790 | Singulation apparatus and method | Chun-Cheng Lin, Yu-Peng Tsai, Ming-Da Cheng, Chung-Shi Liu | 2017-06-13 |
| 9673182 | Package on package bonding structure and method for forming the same | Kuei-Wei Huang, Wei-Yu Chen, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2017-06-06 |
| 9666572 | Process for forming package-on-package structures | Chih-Wei Lin, Ming-Da Cheng, Wen-Hsiung Lu, Kuei-Wei Huang, Chung-Shi Liu | 2017-05-30 |
| 9627369 | Packages and methods for forming the same | Chun-Cheng Lin, Yu-Peng Tsai, Hsiu-Jen Lin, Ming-Da Cheng, Chung-Shi Liu | 2017-04-18 |
| 9627355 | Package-on-package structure having polymer-based material for warpage control | Yu-Chih Liu, Hui-Min Huang, Wei-Hung Lin, Jing Ruei Lu, Ming-Da Cheng +1 more | 2017-04-18 |
| 9576888 | Package on-package joint structure with molding open bumps | Chun-Cheng Lin, Wei-Yu Chen, Ai-Tee Ang, Ming-Da Cheng, Chung-Shi Liu | 2017-02-21 |
| 9508703 | Stacked dies with wire bonds and method | Chen-Hua Yu, Ming-Fa Chen, Sung-Feng Yeh, Hui-Min Huang, Hsiu-Jen Lin +2 more | 2016-11-29 |
| 9484285 | Interconnect structures for wafer level package and methods of forming same | Chih-Wei Lin, Hui-Min Huang, Ming-Da Cheng, Chung-Shi Liu, Chen-Hua Yu | 2016-11-01 |
| 9425178 | RDL-first packaging process | Chih-Wei Lin, Shing-Chao Chen, Ming-Da Cheng, Chung-Shi Liu | 2016-08-23 |
| 9418971 | Package-on-package structure including a thermal isolation material and method of forming the same | Kuei-Wei Huang, Tsai-Tsung Tsai, Ai-Tee Ang, Ming-Da Cheng, Chung-Shi Liu | 2016-08-16 |
| 9412717 | Apparatus and methods for molded underfills in flip chip packaging | Hsiu-Jen Lin, Chun-Cheng Lin, Wen-Hsiung Lu, Ming-Da Cheng, Chung-Shi Liu | 2016-08-09 |
| 9397062 | Package on package bonding structure and method for forming the same | Kuei-Wei Huang, Wei-Yu Chen, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2016-07-19 |
| 9373610 | Process for forming package-on-package structures | Chih-Wei Lin, Ming-Da Cheng, Wen-Hsiung Lu, Kuei-Wei Huang, Chung-Shi Liu | 2016-06-21 |
| 9349663 | Package-on-package structure having polymer-based material for warpage control | Yu-Chih Liu, Hui-Min Huang, Wei-Hung Lin, Jing Ruei Lu, Ming-Da Cheng +1 more | 2016-05-24 |
| 9331038 | Semiconductor interconnect structure | Hsiu-Jen Lin, Chih-Wei Lin, Ming-Da Cheng, Chih-Hang Tung, Chung-Shi Liu | 2016-05-03 |
| 9312214 | Semiconductor packages having polymer-containing substrates and methods of forming same | Chih-Wei Lin, Chun-Cheng Lin, Wen-Hsiung Lu, Ming-Da Cheng, Chung-Shi Liu | 2016-04-12 |
| 9312243 | Semiconductor packages | Yi-Da Tsai, Xi Chen, Tao-Hua Lee, Wei-Yu Chen, Ming-Da Cheng +1 more | 2016-04-12 |
| 9293404 | Pre-applying supporting materials between bonded package components | Yu-Chen Hsu, Yu-Feng Chen, Han-Ping Pu, Guan-Yu Chen | 2016-03-22 |
| 9269687 | Packaging methods and packaged semiconductor devices | Wei-Hung Lin, Yu-Peng Tsai, Chun-Cheng Lin, Chih-Wei Lin, Ming-Da Cheng +1 more | 2016-02-23 |