Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11615972 | Reusable die catch materials, reusable die release materials, related die transfer systems, and methods of using the same | Thomas J. Colosimo, JR., Ting-Chia Huang | 2023-03-28 |
| 9312243 | Semiconductor packages | Meng-Tse Chen, Yi-Da Tsai, Xi Chen, Wei-Yu Chen, Ming-Da Cheng +1 more | 2016-04-12 |
| 8889486 | Methods and apparatus for package on package structures | Meng-Tse Chen, Yi-Da Tsai, Xi Chen, Wei-Yu Chen, Ming-Da Cheng +1 more | 2014-11-18 |