Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431459 | Methods of monitoring gas byproducts of a bonding system, and related monitoring systems and bonding systems | Matthew B. Wasserman | 2025-09-30 |
| 12381175 | Bonding systems, and methods of providing a reducing gas on a bonding system | Adeel Ahmad Bajwa, Matthew B. Wasserman | 2025-08-05 |
| 12062636 | Bonding systems, and methods of providing a reducing gas on a bonding system | Adeel Ahmad Bajwa, Matthew B. Wasserman | 2024-08-13 |
| 11616042 | Methods of bonding of semiconductor elements to substrates, and related bonding systems | Adeel Ahmad Bajwa | 2023-03-28 |
| 11615972 | Reusable die catch materials, reusable die release materials, related die transfer systems, and methods of using the same | Tao-Hua Lee, Ting-Chia Huang | 2023-03-28 |
| 11515286 | Methods of bonding of semiconductor elements to substrates, and related bonding systems | Adeel Ahmad Bajwa | 2022-11-29 |
| 11342301 | Bonding tools for bonding machines, bonding machines for bonding semiconductor elements, and related methods | Ai Jun Song, Jeremy Thomas Neyhart, Benjamin D. Trabin, Matthew B. Wasserman | 2022-05-24 |
| 11205633 | Methods of bonding of semiconductor elements to substrates, and related bonding systems | Adeel Ahmad Bajwa | 2021-12-21 |
| 11049839 | Bonding tools for bonding machines, bonding machines for bonding semiconductor elements, and related methods | Ai Jun Song, Jeremy Thomas Neyhart, Benjamin D. Trabin, Matthew B. Wasserman | 2021-06-29 |
| 10468373 | Bonding machines for bonding semiconductor elements, methods of operating bonding machines, and techniques for improving UPH on such bonding machines | Daniel P. Buergi, Horst Claubeg, Matthew B. Wasserman | 2019-11-05 |
| 10352877 | Systems and methods for measuring physical characteristics of semiconductor device elements using structured light | Deepak Sood, Zhijie Wang, David A. Rauth, Shu-Guo Tang | 2019-07-16 |
| 10245668 | Fluxing systems, bonding machines including fluxing systems, and methods of operating the same | Daniel P. Buergi, Edward Laurent, Michael P. Schmidt-Lange | 2019-04-02 |
| 10153247 | Methods of forming wire interconnect structures | Jon W. Brunner | 2018-12-11 |
| 9929121 | Bonding machines for bonding semiconductor elements, methods of operating bonding machines, and techniques for improving UPH on such bonding machines | Daniel P. Buergi, Horst Clauberg, Matthew B. Wasserman | 2018-03-27 |
| 9865560 | Methods of forming wire interconnect structures | Jon W. Brunner | 2018-01-09 |
| 9847313 | Thermocompression bonders, methods of operating thermocompression bonders, and horizontal scrub motions in thermocompression bonding | Horst Clauberg | 2017-12-19 |
| 9810641 | Systems and methods for measuring physical characteristics of semiconductor device elements using structured light | Deepak Sood, Zhijie Wang, David A. Rauth, Shu-Guo Tang | 2017-11-07 |
| 9731378 | Thermocompression bonders, methods of operating thermocompression bonders, and horizontal correction motions using lateral force measurement in thermocompression bonding | Michael P. Schmidt-Lange, Horst Clauberg, Matthew B. Wasserman | 2017-08-15 |
| 9502371 | Methods of forming wire interconnect structures | Jon W. Brunner | 2016-11-22 |
| 9478516 | Methods of operating bonding machines for bonding semiconductor elements, and bonding machines | Matthew B. Wasserman, Michael P. Schmidt-Lange | 2016-10-25 |
| 9426898 | Thermocompression bonders, methods of operating thermocompression bonders, and interconnect methods for fine pitch flip chip assembly | Guy Frick, Horst Clauberg | 2016-08-23 |
| 9165902 | Methods of operating bonding machines for bonding semiconductor elements, and bonding machines | Matthew B. Wasserman, Michael P. Schmidt-Lange | 2015-10-20 |
| 9016107 | Method of calibrating a constant voltage supply for an ultrasonic transducer of a wire bonding machine | Ivy Wei Qin, John D. Molnar | 2015-04-28 |