Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431459 | Methods of monitoring gas byproducts of a bonding system, and related monitoring systems and bonding systems | Thomas J. Colosimo, JR. | 2025-09-30 |
| 12381175 | Bonding systems, and methods of providing a reducing gas on a bonding system | Adeel Ahmad Bajwa, Thomas J. Colosimo, JR. | 2025-08-05 |
| 12062636 | Bonding systems, and methods of providing a reducing gas on a bonding system | Adeel Ahmad Bajwa, Thomas J. Colosimo, JR. | 2024-08-13 |
| 11342301 | Bonding tools for bonding machines, bonding machines for bonding semiconductor elements, and related methods | Ai Jun Song, Jeremy Thomas Neyhart, Thomas J. Colosimo, JR., Benjamin D. Trabin | 2022-05-24 |
| 11049839 | Bonding tools for bonding machines, bonding machines for bonding semiconductor elements, and related methods | Ai Jun Song, Jeremy Thomas Neyhart, Thomas J. Colosimo, JR., Benjamin D. Trabin | 2021-06-29 |
| 11031367 | Bond head assemblies including reflective optical elements, related bonding machines, and related methods | — | 2021-06-08 |
| 11011493 | Bonding and placement tools for bonding machines, bonding machines for bonding semiconductor elements, and related methods | Ai Jun Song, Daniel P. Buergi, Horst Clauberg, Matthew Tarabulski | 2021-05-18 |
| 10468373 | Bonding machines for bonding semiconductor elements, methods of operating bonding machines, and techniques for improving UPH on such bonding machines | Thomas J. Colosimo, JR., Daniel P. Buergi, Horst Claubeg | 2019-11-05 |
| 9997383 | Bond head assemblies, thermocompression bonding systems and methods of assembling and operating the same | — | 2018-06-12 |
| 9929121 | Bonding machines for bonding semiconductor elements, methods of operating bonding machines, and techniques for improving UPH on such bonding machines | Thomas J. Colosimo, JR., Daniel P. Buergi, Horst Clauberg | 2018-03-27 |
| 9847314 | Bond heads for thermocompression bonders, thermocompression bonders, and methods of operating the same | Michael P. Schmidt-Lange | 2017-12-19 |
| 9780066 | Thermocompression bonding systems and methods of operating the same | — | 2017-10-03 |
| 9731378 | Thermocompression bonders, methods of operating thermocompression bonders, and horizontal correction motions using lateral force measurement in thermocompression bonding | Thomas J. Colosimo, JR., Michael P. Schmidt-Lange, Horst Clauberg | 2017-08-15 |
| 9659902 | Thermocompression bonding systems and methods of operating the same | — | 2017-05-23 |
| 9576928 | Bond head assemblies, thermocompression bonding systems and methods of assembling and operating the same | — | 2017-02-21 |
| 9478516 | Methods of operating bonding machines for bonding semiconductor elements, and bonding machines | Michael P. Schmidt-Lange, Thomas J. Colosimo, JR. | 2016-10-25 |
| 9425163 | Systems and methods for determining and adjusting a level of parallelism related to bonding of semiconductor elements | Michael P. Schmidt-Lange, Christopher W. Braun | 2016-08-23 |
| 9425162 | Bond heads for thermocompression bonders, thermocompression bonders, and methods of operating the same | Michael P. Schmidt-Lange | 2016-08-23 |
| 9165902 | Methods of operating bonding machines for bonding semiconductor elements, and bonding machines | Michael P. Schmidt-Lange, Thomas J. Colosimo, JR. | 2015-10-20 |
| 9136243 | Systems and methods for determining and adjusting a level of parallelism related to bonding of semiconductor elements | Michael P. Schmidt-Lange, Christopher W. Braun | 2015-09-15 |
| 9093549 | Bond heads for thermocompression bonders, thermocompression bonders, and methods of operating the same | Michael P. Schmidt-Lange | 2015-07-28 |