Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10245668 | Fluxing systems, bonding machines including fluxing systems, and methods of operating the same | Daniel P. Buergi, Thomas J. Colosimo, JR., Edward Laurent | 2019-04-02 |
| 9847314 | Bond heads for thermocompression bonders, thermocompression bonders, and methods of operating the same | Matthew B. Wasserman | 2017-12-19 |
| 9731378 | Thermocompression bonders, methods of operating thermocompression bonders, and horizontal correction motions using lateral force measurement in thermocompression bonding | Thomas J. Colosimo, JR., Horst Clauberg, Matthew B. Wasserman | 2017-08-15 |
| 9478516 | Methods of operating bonding machines for bonding semiconductor elements, and bonding machines | Matthew B. Wasserman, Thomas J. Colosimo, JR. | 2016-10-25 |
| 9425162 | Bond heads for thermocompression bonders, thermocompression bonders, and methods of operating the same | Matthew B. Wasserman | 2016-08-23 |
| 9425163 | Systems and methods for determining and adjusting a level of parallelism related to bonding of semiconductor elements | Matthew B. Wasserman, Christopher W. Braun | 2016-08-23 |
| 9373530 | Tool for picking a planar object from a supply station | Kam-Shing Wong, Johannes Schuster | 2016-06-21 |
| 9165902 | Methods of operating bonding machines for bonding semiconductor elements, and bonding machines | Matthew B. Wasserman, Thomas J. Colosimo, JR. | 2015-10-20 |
| 9136243 | Systems and methods for determining and adjusting a level of parallelism related to bonding of semiconductor elements | Matthew B. Wasserman, Christopher W. Braun | 2015-09-15 |
| 9093549 | Bond heads for thermocompression bonders, thermocompression bonders, and methods of operating the same | Matthew B. Wasserman | 2015-07-28 |
| 7681774 | Bond head link assembly for a wire bonding machine | E. Walter Frasch, Richard D. Sadler | 2010-03-23 |
| 7377415 | Bond head link assembly for a wire bonding machine | E. Walter Frasch, Richard D. Sadler | 2008-05-27 |