Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12381175 | Bonding systems, and methods of providing a reducing gas on a bonding system | Thomas J. Colosimo, JR., Matthew B. Wasserman | 2025-08-05 |
| 12062636 | Bonding systems, and methods of providing a reducing gas on a bonding system | Thomas J. Colosimo, JR., Matthew B. Wasserman | 2024-08-13 |
| 11776933 | Methods of bonding semiconductor elements to a substrate, including use of a reducing gas, and related bonding machines | — | 2023-10-03 |
| 11616042 | Methods of bonding of semiconductor elements to substrates, and related bonding systems | Thomas J. Colosimo, JR. | 2023-03-28 |
| 11515286 | Methods of bonding of semiconductor elements to substrates, and related bonding systems | Thomas J. Colosimo, JR. | 2022-11-29 |
| 11257746 | Power distribution within silicon interconnect fabric | Boris Vaisband, Subramanian S. Iyer | 2022-02-22 |
| 11239542 | Network on interconnect fabric and integrated antenna | Boris Vaisband, Subramanian S. Iyer, Arpan Dasgupta, Arsalan Alam | 2022-02-01 |
| 11205633 | Methods of bonding of semiconductor elements to substrates, and related bonding systems | Thomas J. Colosimo, JR. | 2021-12-21 |
| 10930601 | Flexible fan-out wafer level process and structure | Subramanian S. Iyer, Takafumi Fukushima | 2021-02-23 |
| 10861820 | Methods of bonding semiconductor elements to a substrate, including use of a reducing gas, and related bonding machines | — | 2020-12-08 |