Issued Patents All Time
Showing 76–94 of 94 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9257321 | Singulation apparatus and method | Chun-Cheng Lin, Yu-Peng Tsai, Ming-Da Cheng, Chung-Shi Liu | 2016-02-09 |
| 9219030 | Package on package structures and methods for forming the same | Chen-Hua Yu, Mirng-Ji Lii, Chung-Shi Liu, Wei-Hung Lin, Ming-Da Cheng | 2015-12-22 |
| 9117816 | Process for forming package-on-package structures | Chih-Wei Lin, Ming-Da Cheng, Wen-Hsiung Lu, Kuei-Wei Huang, Chung-Shi Liu | 2015-08-25 |
| 9082636 | Packaging methods and structures for semiconductor devices | Chih-Wei Lin, Kuei-Wei Huang, Yu-Peng Tsai, Chun-Cheng Lin, Chen-Hua Yu +7 more | 2015-07-14 |
| 9073158 | Methods for forming 3DIC package | Chun-Cheng Lin, Kuei-Wei Huang, Yu-Peng Tsai, Wei-Hung Lin, Ming-Da Cheng +1 more | 2015-07-07 |
| 9059148 | Contact structure | Wei-Hung Lin, Kuei-Wei Huang, Chih-Wei Lin, Chih-Chun Chiu, Ming-Da Cheng +1 more | 2015-06-16 |
| 9054047 | Exposing connectors in packages through selective treatment | Chen-Hua Yu, Chung-Shi Liu, Chun-Cheng Lin, Ming-Da Cheng | 2015-06-09 |
| 9030022 | Packages and methods for forming the same | Chun-Cheng Lin, Yu-Peng Tsai, Hsiu-Jen Lin, Ming-Da Cheng, Chung-Shi Liu | 2015-05-12 |
| 8975741 | Process for forming package-on-package structures | Chih-Wei Lin, Ming-Da Cheng, Wen-Hsiung Lu, Kuei-Wei Huang, Chung-Shi Liu | 2015-03-10 |
| 8927391 | Package-on-package process for applying molding compound | Wei-Hung Lin, Sheng-Yu Wu, Chun-Cheng Lin, Kuei-Wei Huang, Yu-Peng Tsai +6 more | 2015-01-06 |
| 8928134 | Package on package bonding structure and method for forming the same | Kuei-Wei Huang, Wei-Yu Chen, Wei-Hung Lin, Ming-Da Cheng, Chung-Shi Liu | 2015-01-06 |
| 8889486 | Methods and apparatus for package on package structures | Yi-Da Tsai, Xi Chen, Tao-Hua Lee, Wei-Yu Chen, Ming-Da Cheng +1 more | 2014-11-18 |
| 8884431 | Packaging methods and structures for semiconductor devices | Chih-Wei Lin, Ming-Da Cheng, Wen-Hsiung Lu, Hsiu-Jen Lin, Bor-Ping Jang +7 more | 2014-11-11 |
| 8846448 | Warpage control in a package-on-package structure | Wei-Hung Lin, Kuei-Wei Huang, Tsai-Tsung Tsai, Ai-Tee Ang, Ming-Da Cheng +1 more | 2014-09-30 |
| 8664040 | Exposing connectors in packages through selective treatment | Chen-Hua Yu, Chung-Shi Liu, Chun-Cheng Lin, Ming-Da Cheng | 2014-03-04 |
| 8642445 | Method and apparatus for reducing package warpage | Hui-Min Huang, Chun-Cheng Lin, Chih-Chun Chiu, Ming-Da Cheng, Chung-Shi Liu | 2014-02-04 |
| 8609462 | Methods for forming 3DIC package | Chun-Cheng Lin, Kuei-Wei Huang, Yu-Peng Tsai, Wei-Hung Lin, Ming-Da Cheng +1 more | 2013-12-17 |
| 8603860 | Process for forming packages | Kuei-Wei Huang, Wei-Hung Lin, Wen-Hsiung Lu, Ming-Da Cheng, Chung-Shi Liu | 2013-12-10 |
| 8586408 | Contact and method of formation | Wei-Hung Lin, Kuei-Wei Huang, Chih-Wei Lin, Chih-Chun Chiu, Ming-Da Cheng +1 more | 2013-11-19 |