Issued Patents All Time
Showing 26–42 of 42 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9484226 | Methods for controlling warpage in packaging | Chien Ling Hwang, Hsin-Hung Liao, Yeong-Jyh Lin, Hsiao-Chung Liang, Chung-Shi Liu | 2016-11-01 |
| 9236351 | Semiconductor wafer device | Chien Ling Hwang, Hsin-Hung Liao, Yeong-Jyh Lin | 2016-01-12 |
| 9129899 | Method and system for thinning wafer thereof | Chien Ling Hwang, Hsin-Hung Liao, Chung-Shi Liu | 2015-09-08 |
| 9093337 | Methods for controlling warpage in packaging | Chien Ling Hwang, Hsin-Hung Liao, Yeong-Jyh Lin, Hsiao-Chung Liang, Chung-Shi Liu | 2015-07-28 |
| 9085049 | Method and system for manufacturing semiconductor device | Chien Ling Hwang, Yi-Li Hsiao, Hsin-Hung Liao, Chung-Shi Liu | 2015-07-21 |
| 9082636 | Packaging methods and structures for semiconductor devices | Chih-Wei Lin, Kuei-Wei Huang, Yu-Peng Tsai, Chun-Cheng Lin, Meng-Tse Chen +7 more | 2015-07-14 |
| 8951037 | Wafer-level underfill and over-molding | Yeong-Jyh Lin, Chien Ling Hwang, Chung-Shi Liu | 2015-02-10 |
| 8927391 | Package-on-package process for applying molding compound | Meng-Tse Chen, Wei-Hung Lin, Sheng-Yu Wu, Chun-Cheng Lin, Kuei-Wei Huang +6 more | 2015-01-06 |
| 8884431 | Packaging methods and structures for semiconductor devices | Chih-Wei Lin, Ming-Da Cheng, Wen-Hsiung Lu, Hsiu-Jen Lin, Chung-Shi Liu +7 more | 2014-11-11 |
| 8702871 | Package assembly cleaning process using vaporized solvent | Yi-Li Hsiao, Kuei-Wei Huang, Lin-Wei Wang, Chien Ling Hwang, Chung-Shi Liu | 2014-04-22 |
| 8616433 | Forming low stress joints using thermal compress bonding | Kuei-Wei Huang, Wei-Hung Lin, Lin-Wei Wang, Ming-Da Cheng, Chung-Shi Liu | 2013-12-31 |
| 8556158 | Thermal compress bonding | Kuei-Wei Huang, Wei-Hung Lin, Chung-Shi Liu | 2013-10-15 |
| 8381965 | Thermal compress bonding | Kuei-Wei Huang, Wei-Hung Lin, Chung-Shi Liu | 2013-02-26 |
| 8360303 | Forming low stress joints using thermal compress bonding | Kuei-Wei Huang, Wei-Hung Lin, Lin-Wei Wang, Ming-Da Cheng, Chung-Shi Liu | 2013-01-29 |
| 7005236 | Maintaining photoresist planarity at hole edges | Su-Jen Cheng, Chun-Chieh Wang, Jy-Jie Gau | 2006-02-28 |
| 6778266 | Semiconductor wafer tilt monitoring on semiconductor fabrication equipment plate | Clark Hu, Hendrix Jeng | 2004-08-17 |
| 5843831 | Process independent alignment system | Wen-Jye Chung, Chih-Shih Wei | 1998-12-01 |