Issued Patents All Time
Showing 26–50 of 109 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10748882 | Structure and formation method for chip package | Jui-Pin Hung, Hsien-Wen Liu, Shin-Puu Jeng | 2020-08-18 |
| 10741513 | Conductive external connector structure and method of forming | Meng-Fu Shih, Chun-Yen Lo, Wen-Ming Chen, Chien-Ming Huang, Yuan-Fu Liu +8 more | 2020-08-11 |
| 10741511 | Fan-out package and methods of forming thereof | Wan-Ting Shih, Nai-Wei Liu, Jing-Cheng Lin | 2020-08-11 |
| 10720360 | Semiconductor die singulation and structures formed thereby | Fu-Chen Chang, Wen-Ming Chen | 2020-07-21 |
| 10699981 | Non-vertical through-via in package | Jung-Hua Chang, Jy-Jie Gau, Jing-Cheng Lin | 2020-06-30 |
| 10658195 | Metal oxide layered structure and methods of forming the same | Jing-Cheng Lin | 2020-05-19 |
| 10535554 | Semiconductor die having edge with multiple gradients and method for forming the same | Yu-Sheng Tang, Fu-Chen Chang, Chun-Yen Lo, Wen-Ming Chen, Kuo-Chio Liu | 2020-01-14 |
| 10510605 | Semiconductor die singulation and structures formed thereby | Fu-Chen Chang, Wen-Ming Chen | 2019-12-17 |
| 10446522 | Methods of forming multiple conductive features in semiconductor devices in a same formation process | Meng-Liang Lin | 2019-10-15 |
| 10366960 | Fan-out package and methods of forming thereof | Wan-Ting Shih, Nai-Wei Liu, Jing-Cheng Lin | 2019-07-30 |
| 10361152 | Semiconductor structure having an air-gap region and a method of manufacturing the same | Shu-Hui Su, Jiing-Feng Yang, Zhen-Cheng Wu, Ren-Guei Wu, Dian-Hau Chen +1 more | 2019-07-23 |
| 10163836 | Conductive external connector structure and method of forming | Meng-Fu Shih, Chun-Yen Lo, Wen-Ming Chen, Chien-Ming Huang, Yuan-Fu Liu +8 more | 2018-12-25 |
| 10153175 | Metal oxide layered structure and methods of forming the same | Jing-Cheng Lin | 2018-12-11 |
| 10134701 | Solder bump for ball grid array | Jung-Hua Chang, Jing-Cheng Lin | 2018-11-20 |
| 10115647 | Non-vertical through-via in package | Jung-Hua Chang, Jy-Jie Gau, Jing-Cheng Lin | 2018-10-30 |
| 10074637 | Structure and formation method for chip package | Jui-Pin Hung, Hsien-Wen Liu, Shin-Puu Jeng | 2018-09-11 |
| 10014218 | Method for forming semiconductor device structure with bumps | Meng-Fu Shih, Chien-Chen Li, Che-Jung Chu, Wen-Ming Chen, Kuo-Chio Liu | 2018-07-03 |
| 9953948 | Pillar design for conductive bump | Cheng-Chieh Hsieh, Po-Hao Tsai, Shang-Yun Hou, Jing-Cheng Lin, Shin-Puu Jeng | 2018-04-24 |
| 9881908 | Integrated fan-out package on package structure and methods of forming same | Wen-Yi Lin, Hsien-Wen Liu, Po-Yao Lin, Shyue-Ter Leu, Shin-Puu Jeng | 2018-01-30 |
| 9875979 | Conductive external connector structure and method of forming | Meng-Fu Shih, Chun-Yen Lo, Wen-Ming Chen, Chien-Ming Huang, Yuan-Fu Liu +8 more | 2018-01-23 |
| 9870975 | Chip package with thermal dissipation structure and method for forming the same | Chin-Hua Wang, Po-Yao Lin, Shu-Shen Yeh, Kuang-Chun Lee, Shin-Puu Jeng +2 more | 2018-01-16 |
| 9824989 | Fan-out package and methods of forming thereof | Wan-Ting Shih, Nai-Wei Liu, Jing-Cheng Lin | 2017-11-21 |
| 9748156 | Semiconductor package assembly, semiconductor package and forming method thereof | Shu-Shen Yeh, Chin-Hua Wang, Kuang-Chun Lee, Wen-Yi Lin, Ming-Chih Yew +4 more | 2017-08-29 |
| 9711475 | Bump structural designs to minimize package defects | Jing-Cheng Lin | 2017-07-18 |
| 9711472 | Solder bump for ball grid array | Jung-Hua Chang, Jing-Cheng Lin | 2017-07-18 |