Issued Patents All Time
Showing 26–50 of 50 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10832985 | Sensor package and method | Yu-Chih Huang, Ting-Ting Kuo, Chih-Hsuan Tai, Ban-Li Wu, Ying-Cheng Tseng +5 more | 2020-11-10 |
| 10784203 | Semiconductor package and method | Tzu-Sung Huang, Hsiu-Jen Lin, Hao-Yi Tsai, Ming Hung Tseng, Tin-Hao Kuo +1 more | 2020-09-22 |
| 10700008 | Package structure having redistribution layer structures | Chih-Hao Chang, Hao-Yi Tsai, Tin-Hao Kuo | 2020-06-30 |
| 10515900 | Chip package with fan-out structure | Shing-Chao Chen, Chih-Wei Lin, Ming-Da Cheng, Ching-Hua Hsieh | 2019-12-24 |
| 10468366 | Bonded structures for package and substrate | Ming-Hong Cha, Chen-Shien Chen, Chen-Cheng Kuo, Hao-Juin Liu, Yao-Chun Chuang +1 more | 2019-11-05 |
| 10276509 | Integrated fan-out package | Chih-Hao Chang, Hsin-Hung Liao, Hao-Yi Tsai, Chien Ling Hwang, Wei Sen Chang +1 more | 2019-04-30 |
| 10269702 | Info coil structure and methods of manufacturing same | Chen-Hua Yu, Hao-Yi Tsai, Hung-Yi Kuo, Ming Hung Tseng | 2019-04-23 |
| 10269676 | Thermally enhanced package-on-package (PoP) | Ming Hung Tseng, Chen-Shien Chen | 2019-04-23 |
| 10177073 | Wafer level embedded heat spreader | Wei Sen Chang, Yen-Chang Hu, Ching-Wen Hsiao | 2019-01-08 |
| 10157846 | Method for forming chip package involving cutting process | Shing-Chao Chen, Chih-Wei Lin, Ming-Da Cheng, Ching-Hua Hsieh | 2018-12-18 |
| 9899288 | Interconnect structures for wafer level package and methods of forming same | Chih-Hao Chang, Guan-Yu Chen, Wei Sen Chang, Tin-Hao Kuo, Hao-Yi Tsai +1 more | 2018-02-20 |
| 9870997 | Integrated fan-out package and method of fabricating the same | Chih-Hao Chang, Hsin-Hung Liao, Hao-Yi Tsai, Chien Ling Hwang, Wei Sen Chang +1 more | 2018-01-16 |
| 9735087 | Wafer level embedded heat spreader | Wei Sen Chang, Yen-Chang Hu, Ching-Wen Hsiao | 2017-08-15 |
| 9673161 | Bonded structures for package and substrate | Ming-Hong Cha, Chen-Shien Chen, Chen-Cheng Kuo, Hao-Juin Liu, Yao-Chun Chuang +1 more | 2017-06-06 |
| 9659896 | Interconnect structures for wafer level package and methods of forming same | Chih-Hao Chang, Guan-Yu Chen, Wei Sen Chang, Tin-Hao Kuo, Hao-Yi Tsai +1 more | 2017-05-23 |
| 9580394 | Benzodiazepine derivative and method of producing the same | YU CHANG, Ching-Yun Lee, Cheng-Fang Hsu | 2017-02-28 |
| 9397059 | Bonded structures for package and substrate | Ming-Hong Cha, Chen-Shien Chen, Chen-Cheng Kuo, Hao-Juin Liu, Yao-Chun Chuang +1 more | 2016-07-19 |
| 9150602 | Precursor used for labeling hepatorcyte receptor and containing trisaccharide and diamide demercaptide ligand, method for preparing the same, radiotracer and pharmaceutical composition of the same | Show-Wen Liu, YU CHANG, Cheng-Fang Hsu, MING-CHE TSAI, Yueh-Feng Deng +4 more | 2015-10-06 |
| 9123788 | Bonded structures for package and substrate | Ming-Hong Cha, Chita Chuang, Yao-Chun Chuang, Hao-Juin Liu, Chen-Cheng Kuo +1 more | 2015-09-01 |
| 9044519 | Radiotracer precursor for imaging of hypoxic tissue, radiotracer, and method for preparing the same | Show-Wen Liu, YU CHANG, Cheng-Fang Hsu, Sheng-Lun Lin, Chih-Yuan Lin | 2015-06-02 |
| 9024035 | Radiotracer precursor BANI for imaging of hypoxic tissue, radiotracer, and method for preparing the same | Show-Wen Liu, YU CHANG, Cheng-Fang Hsu, Sheng-Lun Lin, Chih-Yuan Lin | 2015-05-05 |
| 8877943 | Radiotracer precursor and method for preparing the same | Show-Wen Liu, YU CHANG, Cheng-Fang Hsu, MING-CHE TSAI, Yueh-Feng Deng +4 more | 2014-11-04 |
| 8829673 | Bonded structures for package and substrate | Ming-Hong Cha, Chita Chuang, Yao-Chun Chuang, Hao-Juin Liu, Chen-Cheng Kuo +1 more | 2014-09-09 |
| 8753015 | Crossed-roller bearing | Chang-Hsin Kuo, Huang-Sheng Liu | 2014-06-17 |
| 8746409 | Linear transmission assembly having lubricant recovery module | Fu-Chun Huang | 2014-06-10 |