Issued Patents All Time
Showing 51–55 of 55 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8623756 | Reflow system and method for conductive connections | Chita Chuang, Tin-Hao Kuo, Pei-Chun Tsai, Ming-Da Cheng, Chen-Shien Chen | 2014-01-07 |
| 8598691 | Semiconductor devices and methods of manufacturing and packaging thereof | Tin-Hao Kuo, Chen-Shien Chen, Ming-Da Cheng | 2013-12-03 |
| 8510635 | Method for evaluating failure rate | Yun-Chi Yang, Yen-Song Liu, Chin-Hsien Chen, Kuan-Cheng Su | 2013-08-13 |
| D627740 | Eject mechanism | Xue-Wu Bu, Ting-Shun Liu | 2010-11-23 |
| 7256066 | Flip chip packaging process | Jian-Cheng Chen, Yu-Wen Chen | 2007-08-14 |