Issued Patents All Time
Showing 26–44 of 44 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8334170 | Method for stacking devices | Dean Wang, Chen-Shien Chen, Clinton Chao, Mirng-Ji Lii, Tjandra Winata Karta | 2012-12-18 |
| 8247267 | Wafer level IC assembly method | Clinton Chao, Mirng-Ji Lii, Tjandra Winata Karta | 2012-08-21 |
| 8232183 | Process and apparatus for wafer-level flip-chip assembly | Ming-Chung Sung, Clinton Chao, Tjandra Winata Karta | 2012-07-31 |
| 8174114 | Semiconductor package structure with constraint stiffener for cleaning and underfilling efficiency | Yk Hsiao | 2012-05-08 |
| 8169076 | Interconnect structures having lead-free solder bumps | Mirng-Ji Lii, Chen-Hua Yu, Shin-Puu Jeng, Chin-Yu Ku | 2012-05-01 |
| 8039315 | Thermally enhanced wafer level package | Hsin-Hui Lee, Mirng-Ji Lii | 2011-10-18 |
| 7977155 | Wafer-level flip-chip assembly methods | Clinton Chao, Ming-Chung Sung, Tjandra Winata Karta | 2011-07-12 |
| 7851916 | Strain silicon wafer with a crystal orientation (100) in flip chip BGA package | Hsin-Hui Lee, Mickey Ken, Szu-Wei Lu | 2010-12-14 |
| 7846769 | Stratified underfill method for an IC package | Mirng-Ji Lii, Szu-Wei Lu, Tjandra Winata Karta | 2010-12-07 |
| 7842548 | Fixture for P-through silicon via assembly | Chen-Shien Chen, Mirng-Ji Lii, Tjandra Winata Karta | 2010-11-30 |
| 7838424 | Enhanced reliability of wafer-level chip-scale packaging (WLCSP) die separation using dry etching | Tjandra Winata Karta, Steven Hsu, Gene Wu, Jimmy Liang | 2010-11-23 |
| 7833896 | Aluminum cap for reducing scratch and wire-bond bridging of bond pads | Chung Yu Wang | 2010-11-16 |
| 7772691 | Thermally enhanced wafer level package | Hsin-Hui Lee, Mirng-Ji Lii | 2010-08-10 |
| 7656042 | Stratified underfill in an IC package | Mirng-Ji Lii, Szu-Wei Lu, Tjandra Winata Karta | 2010-02-02 |
| 7573138 | Stress decoupling structures for flip-chip assembly | Mirng-Ji Lii | 2009-08-11 |
| 7491624 | Method of manufacturing low CTE substrates for use with low-k flip-chip package devices | Szu-Wei Lu, Hsin-Hui Lee, Mirng-Ji Lii | 2009-02-17 |
| 7170159 | Low CTE substrates for use with low-k flip-chip package devices | Szu-Wei Lu, Hsin-Hui Lee, Mirng-Ji Lii | 2007-01-30 |
| 7148560 | IC chip package structure and underfill process | Hsin-Hui Lee | 2006-12-12 |
| 7026711 | Thermal dispensing enhancement for high performance flip chip BGA (HPFCBGA) | Daniel Lee, Chender Huang | 2006-04-11 |