Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9064817 | Structure of wafer level chip molded package | Hsin-Hui Lee | 2015-06-23 |
| 8647963 | Structure and method of wafer level chip molded packaging | Hsin-Hui Lee | 2014-02-11 |
| 8409881 | Multi-project wafer and method of making same | Mirng-Ji Lii, Chen Yung Ching, Hsin-Hui Lee | 2013-04-02 |
| 7851272 | Multi-project wafer and method of making same | Mirng-Ji Lii, Chen Yung Ching, Hsin-Hui Lee | 2010-12-14 |
| 6902142 | Cup bottom extension apparatus | — | 2005-06-07 |
| D437187 | Handle | — | 2001-02-06 |
| D287388 | Rowing exercise machine or similar article | — | 1986-12-23 |