Issued Patents All Time
Showing 26–50 of 57 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8039315 | Thermally enhanced wafer level package | Mirng-Ji Lii, Chien-Hsiun Lee | 2011-10-18 |
| 7952167 | Scribe line layout design | Mirng-Ji Lii, Shin-Puu Jeng, Shang-Yun Hou | 2011-05-31 |
| 7906425 | Fluxless bumping process | Chao-Yuan Su, Chia-Fu Lin, Yen-Ming Chen, Kai-Ming Ching, Li-Chih Chen +2 more | 2011-03-15 |
| 7851272 | Multi-project wafer and method of making same | William Cheng, Mirng-Ji Lii, Chen Yung Ching | 2010-12-14 |
| 7851916 | Strain silicon wafer with a crystal orientation (100) in flip chip BGA package | Mickey Ken, Chien-Hsiun Lee, Szu-Wei Lu | 2010-12-14 |
| 7772691 | Thermally enhanced wafer level package | Mirng-Ji Lii, Chien-Hsiun Lee | 2010-08-10 |
| 7642631 | Packaged semiconductor chip comprising an integrated circuit chip ablated with laser and cut with saw blade from wafer | Szu-Wei Lu, Ming-Chung Sung, Mirng-Ji Lii | 2010-01-05 |
| 7491624 | Method of manufacturing low CTE substrates for use with low-k flip-chip package devices | Szu-Wei Lu, Chien-Hsiun Lee, Mirng-Ji Lii | 2009-02-17 |
| 7468321 | Application of impressed-current cathodic protection to prevent metal corrosion and oxidation | Kai-Ming Ching, Chia-Fu Lin, Wen-Hsiang Tseng, Ta-Min Lin, Yen-Ming Chen +1 more | 2008-12-23 |
| 7361990 | Reducing cracking of high-lead or lead-free bumps by matching sizes of contact pads and bump pads | Szu-Wei Lu, Chung Yu Wang, Mirng-Ji Lii | 2008-04-22 |
| 7294937 | Apparatus and method for manufacturing a semiconductor wafer with reduced delamination and peeling | Chao-Yuan Su, Pei-Haw Tsao, Chender Huang, Shang Y. Hou, Shin-Puu Jeng +2 more | 2007-11-13 |
| 7276454 | Application of impressed-current cathodic protection to prevent metal corrosion and oxidation | Kai-Ming Ching, Chia-Fu Lin, Wen-Hsiang Tseng, Ta-Min Lin, Yen-Ming Chen +2 more | 2007-10-02 |
| 7265034 | Method of cutting integrated circuit chips from wafer by ablating with laser and cutting with saw blade | Szu-Wei Lu, Ming-Chung Sung, Mirng-Ji Lii | 2007-09-04 |
| 7256071 | Underfilling efficiency by modifying the substrate design of flip chips | Chao-Yuan Su | 2007-08-14 |
| 7183137 | Method for dicing semiconductor wafers | Chien-Chao Huang, Chao-Hsiung Wang, Fu-Liang Yang, Chenming Hu | 2007-02-27 |
| 7170159 | Low CTE substrates for use with low-k flip-chip package devices | Szu-Wei Lu, Chien-Hsiun Lee, Mirng-Ji Lii | 2007-01-30 |
| 7154185 | Encapsulation method for SBGA | Pei-Hwa Tsao, Chao-Yuan Su | 2006-12-26 |
| 7148560 | IC chip package structure and underfill process | Chien-Hsiun Lee | 2006-12-12 |
| 7134199 | Fluxless bumping process | Chao-Yuan Su, Chia-Fu Lin, Yen-Ming Chen, Kai-Ming Ching, Li-Chih Chen +2 more | 2006-11-14 |
| 7126225 | Apparatus and method for manufacturing a semiconductor wafer with reduced delamination and peeling | Chao-Yuan Su, Pei-Haw Tsao, Chender Huang, Shang Y. Hou, Shin-Puu Jeng +2 more | 2006-10-24 |
| 7112882 | Structures and methods for heat dissipation of semiconductor integrated circuits | — | 2006-09-26 |
| 7098082 | Microelectronics package assembly tool and method of manufacture therewith | Chao-Yuan Su | 2006-08-29 |
| 7075016 | Underfilling efficiency by modifying the substrate design of flip chips | Chao-Yuan Su | 2006-07-11 |
| 6974659 | Method of forming a solder ball using a thermally stable resinous protective layer | Chao-Yuan Su, Chia-Fu Lin, Yen-Ming Chen, Kai-Ming Ching, Li-Chih Chen | 2005-12-13 |
| 6805279 | Fluxless bumping process using ions | Chia-Fu Lin, Chao-Yuan Su, Yeng-Ming Chen, Kai-Ming Chin, Li-Chi Chen +1 more | 2004-10-19 |