Issued Patents All Time
Showing 51–57 of 57 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6802250 | Stencil design for solder paste printing | Chao-Yuan Su, Chia-Fu Lin, Yen-Ming Chen, Kai-Ming Ching, Li-Chih Chen | 2004-10-12 |
| 6797075 | Ferris wheel-like stripping or cleaning mechanism for semiconductor fabrication | Kai-Ming Ching, Chia-Fu Lin, Wen-Hsiang Tseng, Ta-Min Lin, Yen-Ming Chen | 2004-09-28 |
| 6756294 | Method for improving bump reliability for flip chip devices | Yen-Ming Chen, Chia-Fu Lin, Shun-Liang Hsu, Kai-Ming Ching, Chao-Yuan Su +1 more | 2004-06-29 |
| 6743660 | Method of making a wafer level chip scale package | Chia-Fu Lin, Chao-Yuan Su, Yen-Ming Chen, Kai-Ming Ching, Li-Chih Chen | 2004-06-01 |
| 6715524 | DFR laminating and film removing system | Li-Chen Chen, Chia-Tsun Hsu, Chia-Fu Lin, Kuo-Ching Lee, Yen-Ming Chen +2 more | 2004-04-06 |
| 6636313 | Method of measuring photoresist and bump misalignment | Yen-Ming Chen, Chia-Fu Lin, Kai-Ming Ching, Chao-Yuan Su, Li-Chih Chen | 2003-10-21 |
| 6602775 | Method to improve reliability for flip-chip device for limiting pad design | Yen-Ming Chen, Chia-Fu Lin, Kai-Ming Ching, Chao-Yuan Su, Li-Chi Chen | 2003-08-05 |