Issued Patents All Time
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7816169 | Colors only process to reduce package yield loss | Chiou-Shian Peng, Cheng-Yu Chu, Shih-Jane Lin, Yen-Ming Chen, Fu-Jier Fan +1 more | 2010-10-19 |
| 7485906 | Colors only process to reduce package yield loss | Chiou-Shian Peng, Cheng-Yu Chu, Shih-Jane Lin, Yen-Ming Chen, Fu-Jier Fan +1 more | 2009-02-03 |
| 7183598 | Colors only process to reduce package yield loss | Chiou-Shian Peng, Cheng-Yu Chu, Shih-Jane Lin, Yen-Ming Chen, Fu-Jier Fan +1 more | 2007-02-27 |
| 6956292 | Bumping process to increase bump height and to create a more robust bump structure | Cheng-Yu Chu, Fu-Jier Fan, Shih-Jane Lin, Chiou-Shian Peng, Yen-Ming Chen +1 more | 2005-10-18 |
| 6936923 | Method to form very a fine pitch solder bump using methods of electroplating | Kuo-Wei Lin, Cheng-Yu Chu, Yen-Ming Chen, Fu-Jier Fan, Chiou-Shian Peng +1 more | 2005-08-30 |
| 6876049 | Colors only process to reduce package yield loss | Chiou-Shian Peng, Cheng-Yu Chu, Shih-Jane Lin, Yen-Ming Chen, Fu-Jier Fan +1 more | 2005-04-05 |
| 6765277 | Microelectronic fabrication with corrosion inhibited bond pad | Yen-Ming Chen, Chia-Fu Lin, Hong-Wen Huang, Cheng-Yu Chu | 2004-07-20 |
| 6649507 | Dual layer photoresist method for fabricating a mushroom bumping plating structure | Yen-Ming Chen, Cheng-Yu Chu, Kuo-Wei Lin, Chiou-Shian Peng, Fu-Jier Fan +1 more | 2003-11-18 |
| 6632700 | Method to form a color image sensor cell while protecting the bonding pad structure from damage | Cheng-Yu Chu, Chiou-Shian Peng, Shih-Jane Lin, Yen-Ming Chen, Fu-Jier Fan +1 more | 2003-10-14 |
| 6605524 | Bumping process to increase bump height and to create a more robust bump structure | Cheng-Yu Chu, Fu-Jier Fan, Shih-Jane Lin, Chiou-Shian Peng, Yen-Ming Chen +1 more | 2003-08-12 |
| 6586323 | Method for dual-layer polyimide processing on bumping technology | Fu-Jier Fan, Cheng-Yu Chu, Kuo-Wei Lin, Shih-Jang Lin, Chiou-Shian Peng | 2003-07-01 |
| 6583039 | Method of forming a bump on a copper pad | Yen-Ming Chen, Kuo-Wei Lin, Cheng-Yu Chu, Fu-Jier Fan, Shih-Jane Lin +2 more | 2003-06-24 |
| 6495813 | Multi-microlens design for semiconductor imaging devices to increase light collection efficiency in the color filter process | Bii-Cheng Chang, Sheng-Liang Pan, Kuo-Liang Lu | 2002-12-17 |
| 6486054 | Method to achieve robust solder bump height | Hsiu-Mei Yu, Li-Hsin Tseng, Kuang-Peng Lin, Ta-Yang Lin | 2002-11-26 |
| 6482669 | Colors only process to reduce package yield loss | Chiou-Shian Peng, Cheng-Yu Chu, Shih-Jane Lin, Yen-Ming Chen, Fu-Jier Fan +1 more | 2002-11-19 |
| 6426281 | Method to form bump in bumping technology | Kuo-Wei Lin, Cheng-Yu Chu, Yen-Ming Chen, Fu-Jier Fan, Chiou-Shian Peng +1 more | 2002-07-30 |
| 6426283 | Method for bumping and backlapping a semiconductor wafer | Yen-Ming Chen, Kuo-Wei Lin, Cheng-Yu Chu, Fu-Jier Fan, Chiou-Shian Peng +1 more | 2002-07-30 |
| 6372545 | Method for under bump metal patterning of bumping process | Fu-Jier Fan, Kuo-Wei Lin, Yen-Ming Chen, Cheng-Yu Chu, Shih-Jane Lin +1 more | 2002-04-16 |
| 6274917 | High efficiency color filter process for semiconductor array imaging devices | Sheng-Liang Pan, Bii-Cheng Chang, Kuo-Liang Lu | 2001-08-14 |
| 6214717 | Method for adding plasma treatment on bond pad to prevent bond pad staining problems | Chao-Yi Lan, Shean-Ren Horng, Chih-Kang Chiu | 2001-04-10 |
| 6200712 | Color filter image array optoelectronic microelectronic fabrication with three dimensional color filter layer and method for fabrication thereof | Chih-Hsiung Lee | 2001-03-13 |
| 6171883 | Image array optoelectronic microelectronic fabrication with enhanced optical stability and method for fabrication thereof | Yu-Kung Hsiao, Chih-Hsiung Lee | 2001-01-09 |
| 6171885 | High efficiency color filter process for semiconductor array imaging devices | Sheng-Liang Pan, Bii-Cheng Chang, Kuo-Liang Lu | 2001-01-09 |
| 6168966 | Fabrication of uniform areal sensitivity image array | Chih-Hsiung Lee | 2001-01-02 |