Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7816169 | Colors only process to reduce package yield loss | Yang-Tung Fan, Cheng-Yu Chu, Shih-Jane Lin, Yen-Ming Chen, Fu-Jier Fan +1 more | 2010-10-19 |
| 7485906 | Colors only process to reduce package yield loss | Yang-Tung Fan, Cheng-Yu Chu, Shih-Jane Lin, Yen-Ming Chen, Fu-Jier Fan +1 more | 2009-02-03 |
| 7183598 | Colors only process to reduce package yield loss | Yang-Tung Fan, Cheng-Yu Chu, Shih-Jane Lin, Yen-Ming Chen, Fu-Jier Fan +1 more | 2007-02-27 |
| 6958546 | Method for dual-layer polyimide processing on bumping technology | Fu-Jier Fan, Cheng-Yu Chu, Kuo-Wei Lin, Shih-Jang Lin, Yang-Tung Fran | 2005-10-25 |
| 6956292 | Bumping process to increase bump height and to create a more robust bump structure | Yang-Tung Fan, Cheng-Yu Chu, Fu-Jier Fan, Shih-Jane Lin, Yen-Ming Chen +1 more | 2005-10-18 |
| 6936923 | Method to form very a fine pitch solder bump using methods of electroplating | Kuo-Wei Lin, Cheng-Yu Chu, Yen-Ming Chen, Yang-Tung Fan, Fu-Jier Fan +1 more | 2005-08-30 |
| 6876049 | Colors only process to reduce package yield loss | Yang-Tung Fan, Cheng-Yu Chu, Shih-Jane Lin, Yen-Ming Chen, Fu-Jier Fan +1 more | 2005-04-05 |
| 6756184 | Method of making tall flip chip bumps | Euegene Chu, Alex Fahn, Kenneth Chenghao Lin, Gilbert Fane, James Chieh-Tsung Chen +1 more | 2004-06-29 |
| 6747336 | Twin current bipolar device with hi-lo base profile | Jun-Lin Tsai, Ruey-Hsing Liu, Kuo-Chio Liu | 2004-06-08 |
| 6649507 | Dual layer photoresist method for fabricating a mushroom bumping plating structure | Yen-Ming Chen, Cheng-Yu Chu, Kuo-Wei Lin, Yang-Tung Fan, Fu-Jier Fan +1 more | 2003-11-18 |
| 6632700 | Method to form a color image sensor cell while protecting the bonding pad structure from damage | Yang-Tung Fan, Cheng-Yu Chu, Shih-Jane Lin, Yen-Ming Chen, Fu-Jier Fan +1 more | 2003-10-14 |
| 6605524 | Bumping process to increase bump height and to create a more robust bump structure | Yang-Tung Fan, Cheng-Yu Chu, Fu-Jier Fan, Shih-Jane Lin, Yen-Ming Chen +1 more | 2003-08-12 |
| 6586323 | Method for dual-layer polyimide processing on bumping technology | Fu-Jier Fan, Cheng-Yu Chu, Kuo-Wei Lin, Shih-Jang Lin, Yang-Tung Fan | 2003-07-01 |
| 6583039 | Method of forming a bump on a copper pad | Yen-Ming Chen, Kuo-Wei Lin, Cheng-Yu Chu, Yang-Tung Fan, Fu-Jier Fan +2 more | 2003-06-24 |
| 6482669 | Colors only process to reduce package yield loss | Yang-Tung Fan, Cheng-Yu Chu, Shih-Jane Lin, Yen-Ming Chen, Fu-Jier Fan +1 more | 2002-11-19 |
| 6426281 | Method to form bump in bumping technology | Kuo-Wei Lin, Cheng-Yu Chu, Yen-Ming Chen, Yang-Tung Fan, Fu-Jier Fan +1 more | 2002-07-30 |
| 6426283 | Method for bumping and backlapping a semiconductor wafer | Yen-Ming Chen, Kuo-Wei Lin, Cheng-Yu Chu, Fu-Jier Fan, Yang-Tung Fan +1 more | 2002-07-30 |
| 6372545 | Method for under bump metal patterning of bumping process | Fu-Jier Fan, Kuo-Wei Lin, Yen-Ming Chen, Cheng-Yu Chu, Shih-Jane Lin +1 more | 2002-04-16 |
| 6319846 | Method for removing solder bodies from a semiconductor wafer | Kuo-Wei Lin, James Chieh-Tsung Chen, Eugene Chu, Alex Fahn, Gilbert Fane +1 more | 2001-11-20 |
| 6211028 | Twin current bipolar device with hi-lo base profile | Jun-Lin Tsai, Ruey-Hsing Liu, Kuo-Chio Liu | 2001-04-03 |