JT

Jun-Lin Tsai

TSMC: 14 patents #2,167 of 12,232Top 20%
📍 Baoshan, TW: #244 of 3,661 inventorsTop 7%
Overall (All Time): #355,220 of 4,157,543Top 9%
14
Patents All Time

Issued Patents All Time

Showing 1–14 of 14 patents

Patent #TitleCo-InventorsDate
7372102 Structure having a shallow trench-deep trench isolation region for a BiCMOS/CMOS technology Kuan-Lun Chang, Ruey-Hsin Liu, Tsyr-Shyang Liou, Chih-Min Chiang 2008-05-13
7250344 Method of forming a shallow trench-deep trench isolation region for a BiCMOS/CMOS technology Kuan-Lun Chang, Ruey-Hsin Liu, Tsyr-Shyang Liou, Chih-Min Chiang 2007-07-31
7015086 Method of forming a shallow trench-deep trench isolation region for a BiCMOS/CMOS technology Kuan-Lun Chang, Ruey-Hsin Liu, Tsyr-Shyang Liou, Chih-Min Chiang 2006-03-21
6747336 Twin current bipolar device with hi-lo base profile Ruey-Hsing Liu, Chiou-Shian Peng, Kuo-Chio Liu 2004-06-08
6569730 High voltage transistor using P+ buried layer Ruey-Hsin Liu, Jei-Feng Hwang, Kuo-Chio Liu 2003-05-27
6423590 High voltage transistor using P+ buried layer Ruey-Hsin Lin, Jei-Feng Hwang, Kuo-Chio Liu 2002-07-23
6396126 High voltage transistor using P+ buried layer Ruey-Hsin Liu, Jyh-Min Jiang, Jei-Feng Hwang 2002-05-28
6340833 Integrated circuit polysilicon resistor having a silicide extension to achieve 100 % metal shielding from hydrogen intrusion Ruey-Hsin Liu, Yung-Lung Hsu 2002-01-22
6245609 High voltage transistor using P+ buried layer Ruey-Hsin Liu, Jei-Feng Hwang, Kuo-Chio Liu 2001-06-12
6242313 Use of polysilicon field plates to improve high voltage bipolar device breakdown voltage Jei-Feng Hwang, Ruey-Hsin Liou, Jyh-Min Jiang 2001-06-05
6211028 Twin current bipolar device with hi-lo base profile Ruey-Hsing Liu, Chiou-Shian Peng, Kuo-Chio Liu 2001-04-03
6165861 Integrated circuit polysilicon resistor having a silicide extension to achieve 100% metal shielding from hydrogen intrusion Ruey-Hsin Liu, Yung-Lung Hsu 2000-12-26
6162695 Field ring to improve the breakdown voltage for a high voltage bipolar device Jei-Feng Hwang, Ruey-Hsin Liou, Kuo-Chio Liu 2000-12-19
6096629 Uniform sidewall profile etch method for forming low contact leakage schottky diode contact Yen-Shih Ho 2000-08-01