Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6756184 | Method of making tall flip chip bumps | Chiou-Shian Peng, Euegene Chu, Alex Fahn, Kenneth Chenghao Lin, James Chieh-Tsung Chen +1 more | 2004-06-29 |
| 6319846 | Method for removing solder bodies from a semiconductor wafer | Kuo-Wei Lin, James Chieh-Tsung Chen, Eugene Chu, Alex Fahn, Chiou-Shian Peng +1 more | 2001-11-20 |