YF

Yang-Tung Fran

TSMC: 1 patents #8,466 of 12,232Top 70%
📍 Tongxiao, TW: #18 of 45 inventorsTop 40%
Overall (All Time): #3,461,461 of 4,157,543Top 85%
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Patents All Time

Issued Patents All Time

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6958546 Method for dual-layer polyimide processing on bumping technology Fu-Jier Fan, Cheng-Yu Chu, Kuo-Wei Lin, Shih-Jang Lin, Chiou-Shian Peng 2005-10-25