HY

Hwei-Mei Yu

TSMC: 1 patents #8,466 of 12,232Top 70%
📍 Baoshan, TW: #2,187 of 3,661 inventorsTop 60%
Overall (All Time): #3,488,733 of 4,157,543Top 85%
1
Patents All Time

Issued Patents All Time

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6784002 Method to make wafer laser marks visable after bumping process Hui Wang, Kuo-Wei Lin, Ta-Yang Lin, Charles Tseng 2004-08-31