Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7960821 | Dummy vias for damascene process | Kuei-Shun Chen, Chin-Hsiang Lin, Vencent Chang, Lai Chien Wen, Jhun Hua Chen | 2011-06-14 |
| 7767570 | Dummy vias for damascene process | Kuei-Shun Chen, Chin-Hsiang Lin, Vencent Chang, Lai Chien Wen, Jhun Hua Chen | 2010-08-03 |
| 7226873 | Method of improving via filling uniformity in isolated and dense via-pattern regions | Yung-Sung Yen, Kuei-Shun Chen, Chia-Hsiang Lin, Tsung-Hsien Lin | 2007-06-05 |
| 6833318 | Gap-filling process | Chun-Jen Weng, Juan-Yi Chen, Hong-Tsz Pan, Cedric Lee, Der-Yuan Wu +3 more | 2004-12-21 |
| 5565376 | Device isolation technology by liquid phase deposition | Water Lur | 1996-10-15 |
| 5449638 | Process on thickness control for silicon-on-insulator technology | Gary Hong, Chen-Chiu Hsue, H. J. Wu | 1995-09-12 |
| 4721682 | Isolation and substrate connection for a bipolar integrated circuit | Scott O. Graham, Hua-Thye Chua | 1988-01-26 |
| 4228578 | Method for off-orientation point rotation sawing of crystalline rod material | Henry W. Gutsche, James Collier | 1980-10-21 |