Issued Patents All Time
Showing 26–50 of 190 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11961789 | Semiconductor package and manufacturing method thereof | Chen-Hua Yu, Chun-Hui Yu | 2024-04-16 |
| 11935760 | Package structure having thermal dissipation structure therein and manufacturing method thereof | Chen-Hua Yu, Yian-Liang Kuo | 2024-03-19 |
| 11929345 | Semiconductor device including binding agent adhering an integrated circuit device to an interposer | Chen-Hua Yu, Chun-Hui Yu | 2024-03-12 |
| 11916028 | Package structure and method of forming the same | Chen-Hua Yu, Chun-Hui Yu | 2024-02-27 |
| 11854936 | Semiconductor device | Chen-Hua Yu, Chun-Hui Yu, Jeng-Nan Hung, Po-Fan Lin | 2023-12-26 |
| 11855020 | Chiplets 3D SoIC system integration and fabrication methods | Chen-Hua Yu | 2023-12-26 |
| 11830844 | Semiconductor structure | Chen-Hua Yu, Chun-Hui Yu, Jeng-Nan Hung, Po-Fan Lin | 2023-11-28 |
| 11804457 | Package structure and manufacturing method thereof | Chen-Hua Yu | 2023-10-31 |
| 11756852 | Semiconductor device | Chen-Hua Yu, Chun-Hui Yu, Jeng-Nan Hung, Po-Fan Lin | 2023-09-12 |
| 11749607 | Package and method of manufacturing the same | Chih-Wei Wu, Chen-Hua Yu, Szu-Wei Lu, Ying-Ching Shih | 2023-09-05 |
| 11728217 | Wafer level package structure and method of forming same | Chen-Hua Yu, Mirng-Ji Lii, Chien-Hsun Lee, Jiun Yi Wu | 2023-08-15 |
| 11694943 | Semiconductor device including heat dissipation structure and fabricating method of the same | Po-Yuan Teng, Chen-Hua Yu, Hao-Yi Tsai, Tin-Hao Kuo, Shih-Wei Chen | 2023-07-04 |
| 11685648 | MEMS packages and methods of manufacture thereof | Chen-Hua Yu | 2023-06-27 |
| 11682629 | Package structure and manufacturing method thereof | Kai-Chiang Wu, Chen-Hua Yu | 2023-06-20 |
| 11658097 | Manufacturing method for semiconductor device including through die hole | Chen-Hua Yu | 2023-05-23 |
| 11658044 | Thermally conductive structure for heat dissipation in semiconductor packages | Chun-Hao Tseng, Ying-Hao Kuo | 2023-05-23 |
| 11640954 | Semiconductor package structure | Jeng-Nan Hung, Chun-Hui Yu, Yi-Da Tsai, Wei-Hung Lin, Ming-Da Cheng +1 more | 2023-05-02 |
| 11637084 | Semiconductor package having a through intervia through the molding compound and fan-out redistribution layers disposed over the respective die of the stacked fan-out system-in-package | Chen-Hua Yu | 2023-04-25 |
| 11581281 | Packaged semiconductor device and method of forming thereof | Chen-Hua Yu, Chih-Hang Tung | 2023-02-14 |
| 11574886 | Thermally conductive molding compound structure for heat dissipation in semiconductor packages | Chun-Hao Tseng, Ying-Hao Kuo | 2023-02-07 |
| 11574853 | Semiconductor device | Chen-Hua Yu, Chun-Hui Yu, Jeng-Nan Hung, Po-Fan Lin | 2023-02-07 |
| 11557546 | Semiconductor structure | Chen-Hua Yu, Jui-Pin Hung | 2023-01-17 |
| 11538788 | Integrated fan-out stacked package with fan-out redistribution layer (RDL) | Chen-Hua Yu, Hao-Yi Tsai, Tin-Hao Kuo | 2022-12-27 |
| 11532594 | Integrated fan-out package and the methods of manufacturing | Chen-Hua Yu, Hao-Yi Tsai, Tin-Hao Kuo | 2022-12-20 |
| 11532529 | Method of manufacturing an integrated fan-out package having fan-out redistribution layer (RDL) to accommodate electrical connectors | Chen-Hua Yu, Hao-Yi Tsai, Tin-Hao Kuo | 2022-12-20 |