Issued Patents All Time
Showing 76–100 of 190 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11018095 | Semiconductor structure | Chen-Hua Yu, Jui-Pin Hung | 2021-05-25 |
| 11004799 | Package structure and manufacturing method thereof | Kai-Chiang Wu, Chen-Hua Yu | 2021-05-11 |
| 10985101 | Semiconductor package and manufacturing method thereof | Yu-Chia Lai, Chi-Hui Lai, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu +1 more | 2021-04-20 |
| 10971462 | Package structure and manufacturing method thereof | Chen-Hua Yu | 2021-04-06 |
| 10971475 | Semiconductor package structure | Jeng-Nan Hung, Chun-Hui Yu, Yi-Da Tsai, Wei-Hung Lin, Ming-Da Cheng +1 more | 2021-04-06 |
| 10964666 | Chip on package structure and method | Chen-Hua Yu, Der-Chyang Yeh, Jui-Pin Hung | 2021-03-30 |
| 10957559 | Thermally conductive structure for heat dissipation in semiconductor packages | Chun-Hao Tseng, Ying-Hao Kuo | 2021-03-23 |
| 10950554 | Semiconductor packages with electromagnetic interference shielding layer and methods of forming the same | Chen-Hua Yu, Chun-Hui Yu | 2021-03-16 |
| 10879220 | Package-on-package structure and manufacturing method thereof | Chen-Hua Yu, Chun-Hui Yu | 2020-12-29 |
| 10879153 | Chip package structure | Chen-Hua Yu, Chun-Hui Yu | 2020-12-29 |
| 10861773 | Semiconductor package and manufacturing method thereof | Chen-Hua Yu, Chun-Hui Yu | 2020-12-08 |
| 10861817 | Thermally conductive molding compound structure for heat dissipation in semiconductor packages | Chun-Hao Tseng, Ying-Hao Kuo | 2020-12-08 |
| 10840231 | Semiconductor device and method of manufacturing | Jui Hsieh Lai, Ying-Hao Kuo | 2020-11-17 |
| 10804242 | Methods of forming multi-die package structures including redistribution layers | Chen-Hua Yu, Tsung-Ding Wang, Chien-Hsun Lee | 2020-10-13 |
| 10784227 | Thermally conductive molding compound structure for heat dissipation in semiconductor packages | Chun-Hao Tseng, Ying-Hao Kuo | 2020-09-22 |
| 10770795 | Antenna device and method for manufacturing antenna device | Chuei-Tang Wang, Chung-Hao Tsai, Jeng-Shien Hsieh, Wei-Heng Lin, Chen-Hua Yu | 2020-09-08 |
| 10770428 | Semiconductor device and method | Chen-Hua Yu, Chun-Hui Yu | 2020-09-08 |
| 10770655 | CHIP package | Chen-Hua Yu | 2020-09-08 |
| 10748825 | Package and method for integration of heterogeneous integrated circuits | Wan-Yu Lee, Chun-Hao Tseng, Jui Hsieh Lai, Tien-Yu Huang, Ying-Hao Kuo | 2020-08-18 |
| 10714525 | Methods and apparatus for sensor module | Chun-Hui Yu | 2020-07-14 |
| 10714457 | Semiconductor packages and methods of forming same | Chen-Hua Yu, Chih-Hang Tung | 2020-07-14 |
| 10707173 | Package structure and manufacturing method thereof | Kai-Chiang Wu, Chen-Hua Yu | 2020-07-07 |
| 10651137 | Manufacturing method of a package structure | Chen-Hua Yu | 2020-05-12 |
| 10629541 | Semiconductor structure and manufacturing method thereof | Chen-Hua Yu, Jui-Pin Hung | 2020-04-21 |
| 10541154 | Thermally conductive structure for heat dissipation in semiconductor packages | Chun-Hao Tseng, Ying-Hao Kuo | 2020-01-21 |