Issued Patents All Time
Showing 51–75 of 190 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11482788 | Antenna device and method for manufacturing antenna device | Chuei-Tang Wang, Chung-Hao Tsai, Jeng-Shien Hsieh, Wei-Heng Lin, Chen-Hua Yu | 2022-10-25 |
| 11462495 | Chiplets 3D SoIC system integration and fabrication methods | Chen-Hua Yu | 2022-10-04 |
| 11393805 | 3D semiconductor packages | Chen-Hua Yu, Chun-Hui Yu, Liang-Ju Yen | 2022-07-19 |
| 11380645 | Semiconductor structure comprising at least one system-on-integrated-circuit component | Chen-Hua Yu, Chun-Hui Yu, Jeng-Nan Hung, Po-Fan Lin | 2022-07-05 |
| 11355418 | Package structure and manufacturing method thereof | Chen-Hua Yu, Chun-Hui Yu, Jeng-Nan Hung | 2022-06-07 |
| 11342309 | Semiconductor packages and methods of forming same | Chen-Hua Yu, Chih-Hang Tung | 2022-05-24 |
| 11328975 | Semiconductor device | Chen-Hua Yu, Chun-Hui Yu, Jeng-Nan Hung, Po-Fan Lin | 2022-05-10 |
| 11328972 | Temporary bonding scheme | Wan-Yu Lee, Ying-Hao Kuo | 2022-05-10 |
| 11289424 | Package and method of manufacturing the same | Chih-Wei Wu, Chen-Hua Yu, Szu-Wei Lu, Ying-Ching Shih | 2022-03-29 |
| 11291116 | Integrated circuit structure | Chen-Hua Yu, Jui-Pin Hung | 2022-03-29 |
| 11211336 | Integrated fan-out package and method for fabricating the same | Chen-Hua Yu, Chun-Hui Yu | 2021-12-28 |
| 11195816 | Integrated circuit packages comprising a plurality of redistribution structures and methods of forming the same | Chen-Hua Yu | 2021-12-07 |
| 11177192 | Semiconductor device including heat dissipation structure and fabricating method of the same | Po-Yuan Teng, Chen-Hua Yu, Hao-Yi Tsai, Tin-Hao Kuo, Shih-Wei Chen | 2021-11-16 |
| 11177434 | Chip package | Chen-Hua Yu | 2021-11-16 |
| 11171076 | Compute-in-memory packages and methods forming the same | Chen-Hua Yu | 2021-11-09 |
| 11152344 | Integrated circuit package and methods of forming same | Chen-Hua Yu, Mirng-Ji Lii, Chien-Hsun Lee, Jiun Yi Wu | 2021-10-19 |
| 11139223 | Semiconductor device and manufacturing method thereof | Chen-Hua Yu, Chun-Hui Yu, Jeng-Nan Hung | 2021-10-05 |
| 11088058 | Method for forming semiconductor package using carbon nano material in molding compound | Chun-Hao Tseng, Ying-Hao Kuo | 2021-08-10 |
| 11075184 | Semiconductor package and method of fabricating semiconductor package | Chen-Hua Yu, Chun-Hui Yu | 2021-07-27 |
| 11075145 | Semiconductor device including through die via and manufacturing method thereof | Chen-Hua Yu | 2021-07-27 |
| 11069636 | Package structure and method of forming the same | Chen-Hua Yu, Chun-Hui Yu | 2021-07-20 |
| 11069573 | Wafer level package structure and method of forming same | Chen-Hua Yu, Mirng-Ji Lii, Chien-Hsun Lee, Jiun Yi Wu | 2021-07-20 |
| 11066297 | MEMS packages and methods of manufacture thereof | Chen-Hua Yu | 2021-07-20 |
| 11062975 | Package structures | Yu-Chia Lai, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Tin-Hao Kuo | 2021-07-13 |
| 11031344 | Package having redistribution layer structure with protective layer and method of fabricating the same | Chen-Hua Yu, Chun-Hui Yu | 2021-06-08 |