Issued Patents All Time
Showing 126–150 of 190 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10137603 | Vacuum carrier module, method of using and process of making the same | Tien-Yu Huang, Chun-Hao Tseng, Ying-Hao Kuo | 2018-11-27 |
| 10135224 | Apparatus and method of forming chip package with waveguide for light coupling having a molding layer for a laser die | Chun-Hao Tseng, Ying-Hao Kuo | 2018-11-20 |
| 10128213 | Integrated fan-out stacked package with fan-out redistribution layer (RDL) | Chen-Hua Yu, Hao-Yi Tsai, Tin-Hao Kuo | 2018-11-13 |
| 10074615 | Package structure and method of fabricating the same | Ying-Cheng Tseng, Chih-Hua Chen, Hsiu-Jen Lin, Hao-Yi Tsai, Chia-Hung Liu | 2018-09-11 |
| 10056351 | Fan-out stacked system in package (SIP) and the methods of making the same | Chen-Hua Yu | 2018-08-21 |
| 10049953 | Method of manufacturing an integrated fan-out package having fan-out redistribution layer (RDL) to accommodate electrical connectors | Chen-Hua Yu, Hao-Yi Tsai, Tin-Hao Kuo | 2018-08-14 |
| 10032722 | Semiconductor package structure having am antenna pattern and manufacturing method thereof | Chen-Hua Yu | 2018-07-24 |
| 10032725 | Semiconductor structure and manufacturing method thereof | Chen-Hua Yu, Jui-Pin Hung | 2018-07-24 |
| 9969614 | MEMS packages and methods of manufacture thereof | Chen-Hua Yu | 2018-05-15 |
| 9966360 | Semiconductor package and manufacturing method thereof | Chen-Hua Yu, Chun-Hui Yu | 2018-05-08 |
| 9960099 | Thermally conductive molding compound structure for heat dissipation in semiconductor packages | Chun-Hao Tseng, Ying-Hao Kuo | 2018-05-01 |
| 9917072 | Method of manufacturing an integrated stacked package with a fan-out redistribution layer (RDL) and a same encapsulating process | Chen-Hua Yu, Hao-Yi Tsai, Tin-Hao Kuo | 2018-03-13 |
| 9902092 | Vacuum carrier module, method of using and process of making the same | Tien-Yu Huang, Chun-Hao Tseng, Ying-Hao Kuo | 2018-02-27 |
| 9899443 | Complementary metal-oxide-semiconductor (CMOS) image sensor (CIS) package with an image buffer | Hsiao-Wen Lee, Kazuaki Hashimoto | 2018-02-20 |
| 9870946 | Wafer level package structure and method of forming same | Chen-Hua Yu, Mirng-Ji Lii, Chien-Hsun Lee, Jiun Yi Wu | 2018-01-16 |
| 9865481 | Package and method for integration of heterogeneous integrated circuits | Wan-Yu Lee, Chun-Hao Tseng, Jui Hsieh Lai, Tien-Yu Huang, Ying-Hao Kuo | 2018-01-09 |
| 9859199 | Method for forming semiconductor package using carbon nano material in molding compound | Chun-Hao Tseng, Ying-Hao Kuo | 2018-01-02 |
| 9831634 | Apparatus and method of forming chip package with waveguide for light coupling | Chun-Hao Tseng, Ying-Hao Kuo | 2017-11-28 |
| 9806069 | Semiconductor device and method of manufacturing | Jui Hsieh Lai, Ying-Hao Kuo | 2017-10-31 |
| 9799528 | Apparatus and package structure of optical chip | Wan-Yu Lee, Chun-Hao Tseng, Jui Hsieh Lai, Tien-Yu Huang, Ying-Hao Kuo | 2017-10-24 |
| 9773757 | Devices, packaged semiconductor devices, and semiconductor device packaging methods | Chen-Hua Yu | 2017-09-26 |
| 9768145 | Methods of forming multi-die package structures including redistribution layers | Chen-Hua Yu, Tsung-Ding Wang, Chien-Hsun Lee | 2017-09-19 |
| 9761513 | Method of fabricating three dimensional integrated circuit | Chun-Hui Yu | 2017-09-12 |
| 9704826 | Chip on package structure and method | Chen-Hua Yu, Der-Chyang Yeh, Jui-Pin Hung | 2017-07-11 |
| 9653442 | Integrated circuit package and methods of forming same | Chen-Hua Yu, Mirng-Ji Lii, Chien-Hsun Lee, Jiun Yi Wu | 2017-05-16 |