Issued Patents All Time
Showing 176–190 of 190 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7528053 | Three-dimensional package and method of making the same | Min-Lung Huang, Wei-Chung Wang, Po-Jen Cheng, Ching-Huei Su, Jian-Wen Lo +1 more | 2009-05-05 |
| 7456051 | Photoelectric device grinding process and device grinding process | Chih-Lung Chen | 2008-11-25 |
| 7446404 | Three-dimensional package and method of making the same | Min-Lung Huang, Wei-Chung Wang, Po-Jen Cheng, Ching-Huei Su, Jian-Wen Lo +1 more | 2008-11-04 |
| 7371602 | Semiconductor package structure and method for manufacturing the same | — | 2008-05-13 |
| 7352071 | Method of fabricating anti-warp package | — | 2008-04-01 |
| 7285434 | Semiconductor package and method for manufacturing the same | Chun-Chi Lee | 2007-10-23 |
| 7247267 | Mold and method of molding semiconductor devices | Jen-Chieh Kao | 2007-07-24 |
| 7053488 | Micro-mirror package | — | 2006-05-30 |
| 7033914 | Method of making a package structure by dicing a wafer from the backside surface thereof | — | 2006-04-25 |
| 7002257 | Optical component package and packaging including an optical component horizontally attached to a substrate | Su Tao, Jen-Chieh Kao | 2006-02-21 |
| 6838762 | Water-level package with bump ring | Su Tao, Jen-Chieh Kao, Chih-Lung Chen, Hsing-Jung Liau | 2005-01-04 |
| 6822324 | Wafer-level package with a cavity and fabricating method thereof | Su Tao, Jen-Chieh Kao, Chih-Lung Chen, Hsing-Jung Liau | 2004-11-23 |
| 6809852 | Microsystem package structure | Su Tao, Jen-Chieh Kao, Chih-Lung Chen, Hsing-Jung Liau | 2004-10-26 |
| 6768207 | Multichip wafer-level package and method for manufacturing the same | Su Tao, Jen-Chieh Kao, Chih-Lung Chen, Hsing-Jung Liau | 2004-07-27 |
| 6693364 | Optical integrated circuit element package and process for making the same | Su Tao, Jen-Chieh Kao, Chih-Lung Chen, Hsing-Jung Liau | 2004-02-17 |