Issued Patents All Time
Showing 151–175 of 190 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9601463 | Fan-out stacked system in package (SIP) and the methods of making the same | Chen-Hua Yu | 2017-03-21 |
| 9583365 | Method of forming interconnects for three dimensional integrated circuit | Chun-Hui Yu, Chen-Hua Yu, Yeong-Jyh Lin, Chia-Hsiang Lin, Liang-Ju Yen +1 more | 2017-02-28 |
| 9576930 | Thermally conductive structure for heat dissipation in semiconductor packages | Chun-Hao Tseng, Ying-Hao Kuo | 2017-02-21 |
| 9564420 | Functional block stacked 3DIC and method of making same | Chen-Hua Yu, Chih-Hang Tung | 2017-02-07 |
| 9530673 | Apparatus and method for self-aligning chip placement and leveling | Jui Hsieh Lai, Ying-Hao Kuo | 2016-12-27 |
| 9496196 | Packages and methods of manufacture thereof | Chen-Hua Yu | 2016-11-15 |
| 9488779 | Apparatus and method of forming laser chip package with waveguide for light coupling | Chun-Hao Tseng, Ying-Hao Kuo | 2016-11-08 |
| 9478475 | Apparatus and package structure of optical chip | Wan-Yu Lee, Chun-Hao Tseng, Jui Hsieh Lai, Tien-Yu Huang, Ying-Hao Kuo | 2016-10-25 |
| 9423578 | Semiconductor device and method of manufacturing | Jui Hsieh Lai, Ying-Hao Kuo | 2016-08-23 |
| 9419156 | Package and method for integration of heterogeneous integrated circuits | Wan-Yu Lee, Chun-Hao Tseng, Jui Hsieh Lai, Tien-Yu Huang, Ying-Hao Kuo | 2016-08-16 |
| 9373527 | Chip on package structure and method | Chen-Hua Yu, Der-Chyang Yeh, Jui-Pin Hung | 2016-06-21 |
| 9368375 | Apparatus and method for self-aligning chip placement and leveling | Jui Hsieh Lai, Ying-Hao Kuo | 2016-06-14 |
| 9293437 | Functional block stacked 3DIC and method of making same | Chen-Hua Yu, Chih-Hang Tung | 2016-03-22 |
| 9264569 | Optical scanner integrated with substrate method of making and method of using the same | Tien-Yu Huang, Ying-Hao Kuo | 2016-02-16 |
| 9244223 | Light coupling formation in a waveguide layer | Chun-Hao Tseng, Ying-Hao Kuo | 2016-01-26 |
| 9202799 | Temporary bonding scheme | Wan-Yu Lee, Ying-Hao Kuo | 2015-12-01 |
| 9136293 | Methods and apparatus for sensor module | Chun-Hui Yu | 2015-09-15 |
| 9099623 | Manufacture including substrate and package structure of optical chip | Wan-Yu Lee, Chun-Hao Tseng, Jui Hsieh Lai, Tien-Yu Huang, Ying-Hao Kuo | 2015-08-04 |
| 9093449 | Apparatus and method for chip placement and molding | Jui Hsieh Lai, Ying-Hao Kuo | 2015-07-28 |
| 8741691 | Method of fabricating three dimensional integrated circuit | Chun-Hui Yu | 2014-06-03 |
| 8288853 | Three-dimensional package and method of making the same | Min-Lung Huang, Wei-Chung Wang, Po-Jen Cheng, Ching-Huei Su, Jian-Wen Lo +1 more | 2012-10-16 |
| 8252629 | Method for making a stackable package | Meng-Jen Wang | 2012-08-28 |
| 8003426 | Method for manufacturing package structure of optical device | — | 2011-08-23 |
| 7741152 | Three-dimensional package and method of making the same | Min-Lung Huang, Wei-Chung Wang, Po-Jen Cheng, Ching-Huei Su, Jian-Wen Lo +1 more | 2010-06-22 |
| 7642132 | Three-dimensional package and method of making the same | Min-Lung Huang, Wei-Chung Wang, Po-Jen Cheng, Ching-Huei Su, Jian-Wen Lo +1 more | 2010-01-05 |