Issued Patents All Time
Showing 26–37 of 37 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8803338 | Semiconductor device having under-bump metallization (UBM) structure and method of forming the same | Tsung-Fu Tsai, Chih-Horng Chang | 2014-08-12 |
| 8580657 | Protecting sidewalls of semiconductor chips using insulation films | Chien-Yi Chen, Yu-Ting Lin, Yung-Sheng Huang | 2013-11-12 |
| 8581399 | Metal bump structure | Tsung-Fu Tsai, Min-Feng Ku | 2013-11-12 |
| 8581420 | Under-bump metallization (UBM) structure and method of forming the same | Tsung-Fu Tsai, Chih-Horng Chang | 2013-11-12 |
| 8569886 | Methods and apparatus of under bump metallization in packaging semiconductor devices | Chia-Wei Tu, Tsung-Fu Tsai, Ru-Ying Huang, Ming-Song Sheu, Hsien-Wei Chen | 2013-10-29 |
| 8507316 | Protecting T-contacts of chip scale packages from moisture | Hui-Chen Chu | 2013-08-13 |
| 8308052 | Thermal gradient reflow for forming columnar grain structures for solder bumps | Chih-Horng Chang, Chih-Hang Tung, Tsung-Fu Tsai | 2012-11-13 |
| 7439751 | Apparatus and method for testing conductive bumps | Yu-Chang Lin, Yu-Ting Lin | 2008-10-21 |
| 7372153 | Integrated circuit package bond pad having plurality of conductive members | Yu-Chang Lin | 2008-05-13 |
| 7180173 | Heat spreader ball grid array (HSBGA) design for low-k integrated circuits (IC) | Yung-Sheng Huang, Yu-Ting Lin | 2007-02-20 |
| 7102372 | Apparatus and method for testing conductive bumps | — | 2006-09-05 |
| 7081209 | Solder mask removal method | — | 2006-07-25 |