Issued Patents All Time
Showing 26–50 of 83 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11335655 | Package structure and manufacturing method thereof | Albert Wan, Chao-Wen Shih, Nan-Chin Chuang | 2022-05-17 |
| 11329056 | SRAM device and manufacturing method thereof | Yi-Hsung Wei, Jia-You Lin, Pei-Hsiu Tseng, Chih-Peng Lee, Chi-Wei Lin | 2022-05-10 |
| 11245176 | Package structure, electronic device and method of fabricating package structure | Min-Chien Hsiao, Chen-Hua Yu, Chung-Shi Liu, Chao-Wen Shih | 2022-02-08 |
| 11211339 | Semiconductor device | Chuei-Tang Wang, Vincent Chen, Tzu-Chun Tang, Chen-Hua Yu, Ching-Feng Yang +5 more | 2021-12-28 |
| 11211358 | Packaged semiconductor devices and packaging methods | Tzu-Chun Tang, Chuei-Tang Wang, Chun-Lin Lu, Wei-Ting Chen, Vincent Chen +1 more | 2021-12-28 |
| 11043731 | Package structure | Nan-Chin Chuang, Chen-Hua Yu, Chung-Shi Liu, Chao-Wen Shih | 2021-06-22 |
| 11004809 | Chip package with antenna element | Yung-Ping Chiang, Yi-Che Chiang, Nien-Fang Wu, Min-Chien Hsiao, Chao-Wen Shih +2 more | 2021-05-11 |
| 10978782 | Semiconductor packages and manufacturing methods thereof | Yung-Ping Chiang, Chao-Wen Shih, Albert Wan, Yu-Sheng Hsieh | 2021-04-13 |
| 10971460 | Integrated devices in semiconductor packages and methods of forming same | Chen-Hua Yu, Kai-Chiang Wu, Chung-Shi Liu, Chao-Wen Shih | 2021-04-06 |
| 10937719 | Package structure and method of fabricating the same | Yung-Ping Chiang, Chao-Wen Shih, Min-Chien Hsiao, Nien-Fang Wu, Yi-Che Chiang | 2021-03-02 |
| 10867940 | Package structure and manufacturing method thereof | Albert Wan, Chao-Wen Shih, Nan-Chin Chuang | 2020-12-15 |
| 10868004 | Semiconductor devices having Fin Field Effect Transistor (FinFET) structures and manufacturing and design methods thereof | Tung Ying Lee, Wen-Huei Guo, Chih-Hao Chang | 2020-12-15 |
| 10825508 | Bit line structure for two-transistor static random access memory | Pei-Hsiu Tseng, I-Shuan Wei, Jia-You Lin, Chi-Wei Lin, Hung Hsun Lin | 2020-11-03 |
| 10727082 | Semiconductor device and manufacturing method thereof | Chun-Lin Lu, Kai-Chiang Wu, Ching-Feng Yang, Vincent Chen, Chuei-Tang Wang +3 more | 2020-07-28 |
| 10636713 | Semiconductor packages and manufacturing methods thereof | Yung-Ping Chiang, Chao-Wen Shih, Albert Wan, Yu-Sheng Hsieh | 2020-04-28 |
| 10535913 | Package structure, electronic device and method of fabricating package structure | Min-Chien Hsiao, Chen-Hua Yu, Chung-Shi Liu, Chao-Wen Shih | 2020-01-14 |
| 10515956 | Semiconductor devices having Fin Field Effect Transistor (FinFET) structures and manufacturing and design methods thereof | Tung Ying Lee, Wen-Huei Guo, Chih-Hao Chang | 2019-12-24 |
| 10510681 | Semiconductor device | Chuei-Tang Wang, Vincent Chen, Tzu-Chun Tang, Chen-Hua Yu, Ching-Feng Yang +5 more | 2019-12-17 |
| 10510714 | Packaged semiconductor devices and packaging methods | Tzu-Chun Tang, Chuei-Tang Wang, Chun-Lin Lu, Wei-Ting Chen, Vincent Chen +1 more | 2019-12-17 |
| 10483617 | Package structure | Nan-Chin Chuang, Chen-Hua Yu, Chung-Shi Liu, Chao-Wen Shih | 2019-11-19 |
| 10475757 | Package structure and manufacturing method thereof | Albert Wan, Chao-Wen Shih, Nan-Chin Chuang | 2019-11-12 |
| 10354964 | Integrated devices in semiconductor packages and methods of forming same | Chen-Hua Yu, Kai-Chiang Wu, Chung-Shi Liu, Chao-Wen Shih | 2019-07-16 |
| 10312203 | Structure and formation method of chip package with antenna element | Yung-Ping Chiang, Nien-Fang Wu, Min-Chien Hsiao, Yi-Che Chiang, Chao-Wen Shih +2 more | 2019-06-04 |
| 10304790 | Method of fabricating an integrated fan-out package | Chung-Hao Tsai, Chuei-Tang Wang, Kai-Chiang Wu, Ming-Kai Liu | 2019-05-28 |
| 10276920 | Package structure, electronic device and method of fabricating package structure | Min-Chien Hsiao, Chen-Hua Yu, Chung-Shi Liu, Chao-Wen Shih | 2019-04-30 |