Issued Patents All Time
Showing 51–75 of 135 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510712 | Methods for controlling warpage in packaging | Bor-Ping Jang, Hsin-Hung Liao, Yeong-Jyh Lin, Hsiao-Chung Liang, Chung-Shi Liu | 2019-12-17 |
| 10504870 | Mechanisms for forming bonding structures | Yeong-Jyh Lin, Hsin-Hung Liao, Bor-Ping Jang, Hsiao-Chung Liang, Chung-Shi Liu | 2019-12-10 |
| 10497619 | Method of manufacturing a semiconductor device including through silicon plugs | Chen-Hua Yu, Chia-Lin Yu, Hung-Pin Chang, Jui-Pin Hung, Yung-Chi Lin | 2019-12-03 |
| 10461051 | Via structure for packaging and a method of forming | Ming-Che Ho, Yi-Wen Wu, Hung-Jui Kuo, Chung-Shi Liu | 2019-10-29 |
| 10438922 | Method and system for mounting components in semiconductor fabrication process | Hsin-Hung Liao, Yu-Ting Chiu, Ching-Hua Hsieh | 2019-10-08 |
| 10366966 | Method of manufacturing integrated fan-out package | Albert Wan, Ching-Hua Hsieh, Chung-Hao Tsai, Chuei-Tang Wang, Chao-Wen Shih +5 more | 2019-07-30 |
| 10276531 | Semiconductor device having a boundary structure, a package on package structure, and a method of making | Yeong-Jyh Lin, Bor-Ping Jang, Hsiao-Chung Liang | 2019-04-30 |
| 10276509 | Integrated fan-out package | Chih-Hao Chang, Hsin-Hung Liao, Hao-Yi Tsai, Wei Sen Chang, Tsung-Hsien Chiang +1 more | 2019-04-30 |
| 10269582 | Package structure, fan-out package structure and method of the same | Hsin-Hung Liao, Yu-Ting Chiu | 2019-04-23 |
| 10163837 | Cu pillar bump with L-shaped non-metal sidewall protection structure | Yi-Wen Wu, Chung-Shi Liu | 2018-12-25 |
| 10157881 | Methods for controlling warpage in packaging | Bor-Ping Jang, Hsin-Hung Liao, Yeong-Jyh Lin, Hsiao-Chung Liang, Chung-Shi Liu | 2018-12-18 |
| 10147693 | Methods for stud bump formation | Yeong-Jyh Lin, Yi-Li Hsiao, Ming-Da Cheng, Tsai-Tsung Tsai, Chung-Shi Liu +2 more | 2018-12-04 |
| 10134700 | Via structure for packaging and a method of forming | Ming-Che Ho, Yi-Wen Wu, Hung-Jui Kuo, Chung-Shi Liu | 2018-11-20 |
| 10115690 | Method of manufacturing micro pins and isolated conductive micro pin | Ying-Jui Huang, Chung-Shi Liu, Hsin-Hung Liao | 2018-10-30 |
| 10056285 | Semiconductor wafer device and manufacturing method thereof | Bor-Ping Jang, Hsin-Hung Liao, Yeong-Jyh Lin | 2018-08-21 |
| 10049931 | Method of manufacturing a semiconductor device including through silicon plugs | Chen-Hua Yu, Hung-Pin Chang, Yung-Chi Lin, Chia-Lin Yu, Jui-Pin Hung | 2018-08-14 |
| 10020211 | Wafer-level molding chase design | Chen-Hua Yu, Chung-Shi Liu, Hui-Min Huang, Chih-Fan Huang, Ming-Da Cheng +2 more | 2018-07-10 |
| 10020236 | Dam for three-dimensional integrated circuit | Tsung-Ding Wang, An-Jhih Su, Jung Wei Cheng, Hsin-Yu Pan, Chen-Hua Yu | 2018-07-10 |
| 9984960 | Integrated fan-out package and method of fabricating the same | Ching-Hua Hsieh, Hsin-Hung Liao, Ying-Jui Huang | 2018-05-29 |
| 9966357 | Pick-and-place tool for packaging process | Ying-Jui Huang, Yi-Li Hsiao | 2018-05-08 |
| 9929118 | Packaging through pre-formed metal pins | Chen-Hua Yu, Yeong-Jyh Lin | 2018-03-27 |
| 9893044 | Wafer-level underfill and over-molding | Bor-Ping Jang, Chung-Shi Liu, Yeong-Jyh Lin | 2018-02-13 |
| 9870997 | Integrated fan-out package and method of fabricating the same | Chih-Hao Chang, Hsin-Hung Liao, Hao-Yi Tsai, Wei Sen Chang, Tsung-Hsien Chiang +1 more | 2018-01-16 |
| 9870929 | Package structure, fan-out package structure and method of the same | Hsin-Hung Liao, Yu-Ting Chiu | 2018-01-16 |
| 9859266 | Method of forming 3D integrated circuit package with panel type lid | Tsung-Ding Wang, Kim Hong Chen, Jung Wei Cheng, Hsin-Yu Pan, Han-Ping Pu | 2018-01-02 |