Issued Patents All Time
Showing 101–125 of 135 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9105760 | Pick-and-place tool for packaging process | Ying-Jui Huang, Yi-Li Hsiao | 2015-08-11 |
| 9093337 | Methods for controlling warpage in packaging | Bor-Ping Jang, Hsin-Hung Liao, Yeong-Jyh Lin, Hsiao-Chung Liang, Chung-Shi Liu | 2015-07-28 |
| 9085049 | Method and system for manufacturing semiconductor device | Bor-Ping Jang, Yi-Li Hsiao, Hsin-Hung Liao, Chung-Shi Liu | 2015-07-21 |
| 9048135 | Copper pillar bump with cobalt-containing sidewall protection | Zheng-Yi Lim, Chung-Shi Liu | 2015-06-02 |
| 9021682 | Apparatus for stud bump formation | Yeong-Jyh Lin, Yi-Li Hsiao, Ming-Da Cheng, Tsai-Tsung Tsai, Chung-Shi Liu +2 more | 2015-05-05 |
| 9018758 | Cu pillar bump with non-metal sidewall spacer and metal top cap | Hui-Jung Tsai, Yi-Wen Wu, Chung-Shi Liu | 2015-04-28 |
| 8951037 | Wafer-level underfill and over-molding | Bor-Ping Jang, Yeong-Jyh Lin, Chung-Shi Liu | 2015-02-10 |
| 8946742 | Semiconductor package with through silicon vias | Chen-Hua Yu, Hung-Pin Chang, Yung-Chi Lin, Chia-Lin Yu, Jui-Pin Hung | 2015-02-03 |
| 8940618 | Method and device for cutting semiconductor wafers | Lin-Wei Wang, Chung-Shi Liu | 2015-01-27 |
| 8936730 | Methods for forming apparatus for stud bump formation | Yeong-Jyh Lin, Hsin-Hung Liao, Chung-Shi Liu, Mirng-Ji Lii, Chen-Hua Yu +1 more | 2015-01-20 |
| 8841766 | Cu pillar bump with non-metal sidewall protection structure | Yi-Wen Wu, Chun-Chieh Wang, Chung-Shi Liu | 2014-09-23 |
| 8834662 | Apparatus and method of separating wafer from carrier | Lin-Wei Wang, Chung-Shi Liu | 2014-09-16 |
| 8827695 | Wafer's ambiance control | Yi-Li Hsiao, Chen-Hua Yu, Jean Wang, Ming-Che Ho, Jui-Pin Hung | 2014-09-09 |
| 8823166 | Pillar bumps and process for making same | Cheng-Chung Lin, Chung-Shi Liu, Meng-Wei Chou, Kuo-Cheng Lin, Wen-Hsiung Lu +2 more | 2014-09-02 |
| 8823167 | Copper pillar bump with non-metal sidewall protection structure and method of making the same | Yi-Wen Wu, Cheng-Chung Lin, Chung-Shi Liu | 2014-09-02 |
| 8702871 | Package assembly cleaning process using vaporized solvent | Yi-Li Hsiao, Bor-Ping Jang, Kuei-Wei Huang, Lin-Wei Wang, Chung-Shi Liu | 2014-04-22 |
| 8679591 | Method for reducing voids in a copper-tin interface and structure formed thereby | Yi-Li Hsiao, Chung-Shi Liu | 2014-03-25 |
| 8668131 | In-situ accuracy control in flux dipping | Yi-Li Hsiao, Chen-Hua Yu, Chung-Shi Liu | 2014-03-11 |
| 8652260 | Apparatus for holding semiconductor wafers | Chen-Hua Yu | 2014-02-18 |
| 8587119 | Conductive feature for semiconductor substrate and method of manufacture | Yi-Wen Wu, Chung-Shi Liu | 2013-11-19 |
| 8569897 | Protection layer for preventing UBM layer from chemical attack and oxidation | Chung-Shi Liu, Ming-Che Ho | 2013-10-29 |
| 8569887 | Post passivation interconnect with oxidation prevention layer | Yi-Wen Wu, Chung-Shi Liu | 2013-10-29 |
| 8546802 | Pick-and-place tool for packaging process | Ying-Jui Huang, Yi-Li Hsiao | 2013-10-01 |
| 8540136 | Methods for stud bump formation and apparatus for performing the same | Yeong-Jyh Lin, Hsin-Hung Liao, Yi-Li Hsiao, Chung-Shi Liu, Mirng-Ji Lii +1 more | 2013-09-24 |
| 8507940 | Heat dissipation by through silicon plugs | Chen-Hua Yu, Hung-Pin Chang, Yung-Chi Lin, Chia-Lin Yu, Jui-Pin Hung | 2013-08-13 |