Issued Patents All Time
Showing 76–100 of 135 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9812346 | Semiconductor wafer device and manufacturing method thereof | Bor-Ping Jang, Hsin-Hung Liao, Yeong-Jyh Lin | 2017-11-07 |
| 9802349 | Wafer level transfer molding and apparatus for performing the same | Bor-Ping Jang, Yeong-Jyh Lin, Chung-Shi Liu, Meng-Tse Chen, Ming-Da Cheng +1 more | 2017-10-31 |
| 9768142 | Mechanisms for forming bonding structures | Yeong-Jyh Lin, Hsin-Hung Liao, Bor-Ping Jang, Hsiao-Chung Liang, Chung-Shi Liu | 2017-09-19 |
| 9735039 | Apparatus for separating wafer from carrier | Lin-Wei Wang, Chung-Shi Liu | 2017-08-15 |
| 9700950 | Innovative multi-purpose dipping plate | Bor-Ping Jang, Lin-Wei Wang, Ying-Jui Huang, Yi-Li Hsiao, Chung-Shi Liu | 2017-07-11 |
| 9685372 | Method of forming Cu pillar bump with non-metal sidewall spacer and metal top cap | Hui-Jung Tsai, Yi-Wen Wu, Chung-Shi Liu | 2017-06-20 |
| 9659891 | Semiconductor device having a boundary structure, a package on package structure, and a method of making | Yeong-Jyh Lin, Bor-Ping Jang, Hsiao-Chung Liang | 2017-05-23 |
| 9601355 | Via structure for packaging and a method of forming | Ming-Che Ho, Yi-Wen Wu, Hung-Jui Kuo, Chung-Shi Liu | 2017-03-21 |
| 9524945 | Cu pillar bump with L-shaped non-metal sidewall protection structure | Yi-Wen Wu, Chung-Shi Liu | 2016-12-20 |
| 9498851 | Methods for forming apparatus for stud bump formation | Yeong-Jyh Lin, Hsin-Hung Liao, Yi-Li Hsiao, Chung-Shi Liu, Mirng-Ji Lii +1 more | 2016-11-22 |
| 9502383 | 3D integrated circuit package processing with panel type lid | Tsung-Ding Wang, Han-Ping Pu, Kim Hong Chen, Jung Wei Cheng, Hsin-Yu Pan | 2016-11-22 |
| 9484226 | Methods for controlling warpage in packaging | Bor-Ping Jang, Hsin-Hung Liao, Yeong-Jyh Lin, Hsiao-Chung Liang, Chung-Shi Liu | 2016-11-01 |
| 9460939 | Package-on-package structures and methods of manufacture thereof | Pei-Hsuan Lee, Chung-Shi Liu, Chen-Hua Yu | 2016-10-04 |
| 9449931 | Pillar bumps and process for making same | Cheng-Chung Lin, Chung-Shi Liu, Meng-Wei Chou, Kuo-Cheng Lin, Wen-Hsiung Lu +2 more | 2016-09-20 |
| 9425179 | Chip packages and methods of manufacture thereof | Pei-Hsuan Lee, Ying-Jui Huang, Yeong-Jyh Lin, Chung-Shi Liu | 2016-08-23 |
| 9418953 | Packaging through pre-formed metal pins | Chen-Hua Yu, Yeong-Jyh Lin | 2016-08-16 |
| 9368460 | Fan-out interconnect structure and method for forming same | Chen-Hua Yu, Yen-Chang Hu, Ching-Wen Hsiao, Mirng-Ji Lii, Chung-Shi Liu +2 more | 2016-06-14 |
| 9324670 | Semiconductor device with copper-tin compound on copper connector | Yi-Li Hsiao, Chung-Shi Liu | 2016-04-26 |
| 9287171 | Method of making a conductive pillar bump with non-metal sidewall protection structure | Yi-Wen Wu, Cheng-Chung Lin, Chung-Shi Liu | 2016-03-15 |
| 9287440 | Method of manufacturing a semiconductor device including through silicon plugs | Chen-Hua Yu, Hung-Pin Chang, Yung-Chi Lin, Chia-Lin Yu, Jui-Pin Hung | 2016-03-15 |
| 9275965 | Copper pillar bump with cobalt-containing sidewall protection layer | Zheng-Yi Lim, Chung-Shi Liu | 2016-03-01 |
| 9263302 | Via structure for packaging and a method of forming | Ming-Che Ho, Yi-Wen Wu, Hung-Jui Kuo, Chung-Shi Liu | 2016-02-16 |
| 9236351 | Semiconductor wafer device | Bor-Ping Jang, Hsin-Hung Liao, Yeong-Jyh Lin | 2016-01-12 |
| 9136167 | Method of making a pillar structure having a non-metal sidewall protection structure | Yi-Wen Wu, Chun-Chieh Wang, Chung-Shi Liu | 2015-09-15 |
| 9129899 | Method and system for thinning wafer thereof | Bor-Ping Jang, Hsin-Hung Liao, Chung-Shi Liu | 2015-09-08 |