Issued Patents All Time
Showing 126–135 of 135 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8441124 | Cu pillar bump with non-metal sidewall protection structure | Yi-Wen Wu, Cheng-Chung Lin, Chung-Shi Liu | 2013-05-14 |
| 8373269 | Jigs with controlled spacing for bonding dies onto package substrates | Yi-Li Hsiao, Chen-Hua Yu, Chung-Shi Liu | 2013-02-12 |
| 8317077 | Thermal compressive bonding with separate die-attach and reflow processes | Ying-Jui Huang, Cheng-Chung Lin, Chung-Shi Liu | 2012-11-27 |
| 8258055 | Method of forming semiconductor die | Ying-Jui Huang, Zheng-Yi Lim, Yi-Yang Lei, Cheng-Chung Lin, Chung-Shi Liu | 2012-09-04 |
| 8227334 | Doping minor elements into metal bumps | Ming-Da Cheng, Ming-Che Ho, Chung-Shi Liu, Cheng-Chung Lin, Hui-Jung Tsai +1 more | 2012-07-24 |
| 8177862 | Thermal compressive bond head | Cheng-Chung Lin, Ying-Jui Huang, Chung-Shi Liu | 2012-05-15 |
| 8133097 | Polishing apparatus | Yu-Liang Lin, Jean Wang, Chen-Hua Yu | 2012-03-13 |
| 8104666 | Thermal compressive bonding with separate die-attach and reflow processes | Ying-Jui Huang, Cheng-Chung Lin, Chung-Shi Liu | 2012-01-31 |
| 7966968 | Electroless plating apparatus with non-liquid heating source | Cheng-Hsun Chan | 2011-06-28 |
| 7905109 | Rapid cooling system for RTP chamber | Yu-Liang Lin, Fu-Kang Tien, Jyh-Chemg Sheu | 2011-03-15 |