Issued Patents All Time
Showing 26–48 of 48 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8344506 | Interface structure for copper-copper peeling integrity | Chung-Shi Liu, Chen-Hua Yu | 2013-01-01 |
| 8317077 | Thermal compressive bonding with separate die-attach and reflow processes | Chien Ling Hwang, Ying-Jui Huang, Chung-Shi Liu | 2012-11-27 |
| 8269549 | Power supply circuit for PCI-E slot | Wu Jiang | 2012-09-18 |
| 8258055 | Method of forming semiconductor die | Chien Ling Hwang, Ying-Jui Huang, Zheng-Yi Lim, Yi-Yang Lei, Chung-Shi Liu | 2012-09-04 |
| 8227334 | Doping minor elements into metal bumps | Ming-Da Cheng, Ming-Che Ho, Chung-Shi Liu, Chien Ling Hwang, Hui-Jung Tsai +1 more | 2012-07-24 |
| 8177862 | Thermal compressive bond head | Chien Ling Hwang, Ying-Jui Huang, Chung-Shi Liu | 2012-05-15 |
| 8104666 | Thermal compressive bonding with separate die-attach and reflow processes | Chien Ling Hwang, Ying-Jui Huang, Chung-Shi Liu | 2012-01-31 |
| 8053894 | Surface treatment of metal interconnect lines | Wen-Kai Wan, Yih-Hsiung Lin, Ming-Ta Lei, Baw-Ching Perng, Chia-Hui Lin +1 more | 2011-11-08 |
| 7271103 | Surface treated low-k dielectric as diffusion barrier for copper metallization | Kuei-Wu Huang, Ai-Sen Liu, Baw-Ching Perng, Ming-Ta Lei, Wen-Kai Wan +2 more | 2007-09-18 |
| 7176137 | Method for multiple spacer width control | Baw-Ching Perng, Yih-Shung Lin, Ming-Ta Lei, Ai-Sen Liu, Chia-Hui Lin | 2007-02-13 |
| 7011929 | Method for forming multiple spacer widths | Ming-Ta Lei, Yih-Shung Lin, Ai-Sen Liu, Baw-Ching Perng, Chia-Hui Lin | 2006-03-14 |
| 6955984 | Surface treatment of metal interconnect lines | Wen-Kai Wan, Yih-Hsiung Lin, Ming LEI, Baw-Ching Perng, Chia-Hui Lin +1 more | 2005-10-18 |
| 6943077 | Selective spacer layer deposition method for forming spacers with different widths | Ai-Sen Liu, Baw-Ching Perng, Ming-Ta Lei, Yih-Shung Lin, Chia-Hui Lin | 2005-09-13 |
| 6794295 | Method to improve stability and reliability of CVD low K dielectric | Lain-Jong Li | 2004-09-21 |
| 6746900 | Method for forming a semiconductor device having high-K gate dielectric material | Ai-Sen Liu, Baw-Ching Perng, Ming-Ta Lei, Wen-Kai Wan, Kuei-Wu Huang +2 more | 2004-06-08 |
| 6645864 | Physical vapor deposition of an amorphous silicon liner to eliminate resist poisoning | Lain-Jong Li | 2003-11-11 |
| D464501 | Computer desk | — | 2002-10-22 |
| 6407013 | Soft plasma oxidizing plasma method for forming carbon doped silicon containing dielectric layer with enhanced adhesive properties | Lain-Jong Li, Tien-I Bao, Syun-Ming Jang | 2002-06-18 |
| D458054 | Rack | — | 2002-06-04 |
| 6383935 | Method of reducing dishing and erosion using a sacrificial layer | Chen-Hua Yu, Tsu Shih, Weng Chang | 2002-05-07 |
| 6372661 | Method to improve the crack resistance of CVD low-k dielectric constant material | Shwang-Ming Jeng, Lain-Jong Li | 2002-04-16 |
| 6197706 | Low temperature method to form low k dielectric | Lain-Jang Li, Syun-Ming Jang | 2001-03-06 |
| 6171170 | Musical rotating luminous device | — | 2001-01-09 |