Issued Patents All Time
Showing 51–66 of 66 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10461023 | Semiconductor packages and methods of forming the same | Mao-Yen Chang, Hao-Yi Tsai, Tin-Hao Kuo, Tzung-Hui Lee, Teng-Yuan Lo +1 more | 2019-10-29 |
| 10153249 | Dual-sided integrated fan-out package | Wei Sen Chang, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu | 2018-12-11 |
| 10134706 | Warpage control of semiconductor die package | Ching-Wen Hsiao, Chen-Shien Chen | 2018-11-20 |
| 10125014 | Integrated circuit package and method of forming same | Chung-Shi Liu, Hao-Yi Tsai, Yu-Feng Chen, Yu-Jen Cheng | 2018-11-13 |
| 9947552 | Structure and formation method of chip package with fan-out structure | Shing-Chao Chen, Chih-Wei Lin, Meng-Tse Chen, Hui-Min Huang, Ming-Da Cheng +3 more | 2018-04-17 |
| 9935081 | Hybrid interconnect for chip stacking | Yu-Feng Chen, Chen-Shien Chen, Mirng-Ji Lii | 2018-04-03 |
| 9850126 | Integrated circuit package and method of forming same | Chung-Shi Liu, Hao-Yi Tsai, Yu-Feng Chen, Yu-Jen Cheng | 2017-12-26 |
| 9837346 | Packaging device having plural microstructures disposed proximate to die mounting region | Yu-Feng Chen, Chen-Shien Chen | 2017-12-05 |
| 9773749 | Warpage control of semiconductor die package | Ching-Wen Hsiao, Chen-Shien Chen | 2017-09-26 |
| 9735130 | Chip packages and methods of manufacture thereof | Ying-Jui Huang, Yu-Feng Chen, Chen-Shien Chen | 2017-08-15 |
| 9666530 | Semiconductor device | Chen-Shien Chen, Yu-Chih Huang, Yu-Feng Chen, Yu-Jen Cheng, Mirng-Ji Lii +2 more | 2017-05-30 |
| 9620465 | Dual-sided integrated fan-out package | Wei Sen Chang, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu | 2017-04-11 |
| 9607959 | Packaging device having plural microstructures disposed proximate to die mounting region | Yu-Feng Chen, Chen-Shien Chen | 2017-03-28 |
| 9508674 | Warpage control of semiconductor die package | Ching-Wen Hsiao, Chen-Shien Chen | 2016-11-29 |
| 9070667 | Peripheral electrical connection of package on package | Ching-Wen Hsiao, Chih-Wei Lin, Wei Sen Chang, Yen-Chang Hu, Yu-Chih Huang | 2015-06-30 |
| 9059107 | Packaging methods and packaged devices | Ming Hung Tseng, Chen-Shien Chen | 2015-06-16 |