Issued Patents All Time
Showing 26–50 of 66 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11646255 | Chip package structure including a silicon substrate interposer and methods for forming the same | Yu-Chia Lai, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu, Chen-Hua Yu +3 more | 2023-05-09 |
| 11538735 | Method of forming integrated circuit packages with mechanical braces | Shu-Rong Chun, Pei-Hsuan Lee, Chien Ling Hwang, Yu-Chia Lai, Tin-Hao Kuo +2 more | 2022-12-27 |
| 11508656 | Semiconductor package and method | Shu-Rong Chun, Teng-Yuan Lo, Hung-Yi Kuo, Chih-Horng Chang, Tin-Hao Kuo +1 more | 2022-11-22 |
| 11508665 | Packages with thick RDLs and thin RDLs stacked alternatingly | Po-Yuan Teng, Yu-Chia Lai, Tin-Hao Kuo, Hao-Yi Tsai, Chen-Hua Yu | 2022-11-22 |
| 11502013 | Integrated circuit package and method | Shu-Rong Chun, Tin-Hao Kuo, Hao-Yi Tsai, Pei-Hsuan Lee, Chien Ling Hwang +3 more | 2022-11-15 |
| 11495590 | Multi-chip semiconductor package | Yu-Chia Lai, Hung-Yi Kuo, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu +1 more | 2022-11-08 |
| 11488897 | Integrated circuit package and method | Chi-Hui Lai, Shu-Rong Chun, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu +1 more | 2022-11-01 |
| 11444002 | Package structure | Yu-Chia Lai, Chen-Hua Yu, Chung-Shi Liu, Hsiao-Chung Liang, Hao-Yi Tsai +4 more | 2022-09-13 |
| 11424213 | Semiconductor structure including a first surface mount component and a second surface mount component and method of fabricating the semiconductor structure | Mao-Yen Chang, Chih-Wei Lin, Hao-Yi Tsai, Chun-Cheng Lin, Tin-Hao Kuo +2 more | 2022-08-23 |
| 11355466 | Package structure and manufacturing method of package structure thereof | Po-Yuan Teng, Hao-Yi Tsai, Sen-Kuei Hsu, Tin-Hao Kuo, Yi-Yang Lei +2 more | 2022-06-07 |
| 11322421 | Package structure and method of forming the same | Mao-Yen Chang, Chih-Wei Lin, Hao-Yi Tsai, Chun-Cheng Lin, Tin-Hao Kuo +2 more | 2022-05-03 |
| 11309294 | Integrated fan-out packages and methods of forming the same | Chen-Hua Yu, Tin-Hao Kuo, Hao-Yi Tsai, Hsiu-Jen Lin, Hao-Jan Pei +1 more | 2022-04-19 |
| 11239135 | Package structure and method of manufacturing the same | Shih-Wei Chen, Hao-Yi Tsai, Tin-Hao Kuo, Po-Yuan Teng, Chi-Hui Lai | 2022-02-01 |
| 11201118 | Chip package and method of forming the same | Hao-Yi Tsai, Tin-Hao Kuo | 2021-12-14 |
| 11183487 | Integrated circuit package and method | Chi-Hui Lai, Shu-Rong Chun, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu +2 more | 2021-11-23 |
| 11121070 | Integrated fan-out package | Shu-Rong Chun, Tin-Hao Kuo, Chi-Hui Lai, Hao-Yi Tsai, Chung-Shi Liu +1 more | 2021-09-14 |
| 11107771 | Segregated power and ground design for yield improvement | Shu-Rong Chun, Tin-Hao Kuo, Chi-Hui Lai, Yu-Chia Lai, Hao-Yi Tsai +2 more | 2021-08-31 |
| 11049805 | Semiconductor package and method | Shu-Rong Chun, Teng-Yuan Lo, Hung-Yi Kuo, Chih-Horng Chang, Tin-Hao Kuo +1 more | 2021-06-29 |
| 11004758 | Integrated circuit package and method | Shu-Rong Chun, Tin-Hao Kuo, Hao-Yi Tsai, Pei-Hsuan Lee, Chien Ling Hwang +3 more | 2021-05-11 |
| 11004827 | Semiconductor package and manufacturing method of semiconductor package | Wei-Kang Hsieh, Hung-Yi Kuo, Hao-Yi Tsai, Tin-Hao Kuo, Yu-Chia Lai +3 more | 2021-05-11 |
| 10978382 | Integrated circuit package and method | Chi-Hui Lai, Shu-Rong Chun, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu +1 more | 2021-04-13 |
| 10861823 | Dual-sided integrated fan-out package | Wei Sen Chang, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu | 2020-12-08 |
| 10847505 | Multi-chip semiconductor package | Yu-Chia Lai, Hung-Yi Kuo, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu +1 more | 2020-11-24 |
| 10840111 | Chip package with fan-out structure | Shing-Chao Chen, Chih-Wei Lin, Meng-Tse Chen, Hui-Min Huang, Ming-Da Cheng +3 more | 2020-11-17 |
| 10658258 | Chip package and method of forming the same | Hao-Yi Tsai, Tin-Hao Kuo | 2020-05-19 |