Issued Patents All Time
Showing 51–74 of 74 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9490203 | Capacitor in post-passivation structures and methods of forming the same | Hao-Yi Tsai, Hsien-Wei Chen, Hung-Yi Kuo, Ying-Ju Chen, Tsung-Yuan Yu +1 more | 2016-11-08 |
| 9484318 | Semiconductor device and manufacturing method thereof | Yu-Chia Lai, Hsien-Ming Tu, Chang-Pin Huang, Ching-Jung Yang | 2016-11-01 |
| 9449927 | Seal ring structure with metal-insulator-metal capacitor | Hsien-Wei Chen, Ching-Jung Yang, Yu-Chia Lai, Hao-Yi Tsai, Tsung-Yuan Yu | 2016-09-20 |
| 9355954 | Capacitor in post-passivation structures and methods of forming the same | Hao-Yi Tsai, Hsien-Wei Chen, Hung-Yi Kuo, Ying-Ju Chen, Tsung-Yuan Yu +1 more | 2016-05-31 |
| 9343417 | Hollow metal pillar packaging scheme | Chang-Pin Huang, Hsien-Ming Tu, Hsien-Wei Chen, Ching-Jung Yang, Yu-Chia Lai | 2016-05-17 |
| 9318456 | Self-alignment structure for wafer level chip scale package | Yu-Chia Lai, Hsien-Ming Tu, Hsien-Wei Chen, Chang-Pin Huang, Ching-Jung Yang | 2016-04-19 |
| 9153504 | Metal insulator metal capacitor and method for making the same | Yu-Chia Lai, Ching-Jung Yang | 2015-10-06 |
| 9136143 | Thermally enhanced structure for multi-chip device | Chen-Hua Yu, Chih-Hang Tung | 2015-09-15 |
| 9136318 | Capacitor in post-passivation structures and methods of forming the same | Hao-Yi Tsai, Hsien-Wei Chen, Hung-Yi Kuo, Ying-Ju Chen, Tsung-Yuan Yu +1 more | 2015-09-15 |
| 9048149 | Self-alignment structure for wafer level chip scale package | Yu-Chia Lai, Hsien-Ming Tu, Hsien-Wei Chen, Chang-Pin Huang, Ching-Jung Yang | 2015-06-02 |
| 8963328 | Reducing delamination between an underfill and a buffer layer in a bond structure | Ching-Jung Yang, Chang-Pin Huang, Tzuan-Horng Liu, Michael Shou-Ming Tong, Ying-Ju Chen +3 more | 2015-02-24 |
| 8884400 | Capacitor in Post-Passivation structures and methods of forming the same | Hao-Yi Tsai, Hsien-Wei Chen, Hung-Yi Kuo, Ying-Ju Chen, Tsung-Yuan Yu +1 more | 2014-11-11 |
| 8754514 | Multi-chip wafer level package | Chun-Hui Yu, Chih-Hang Tung, Chen-Hua Yu, Da-Yuan Shih | 2014-06-17 |
| 8685798 | Methods for forming through vias | Chih-Hang Tung, Chen-Hua Yu, Hao-Yi Tsai, Mirng-Ji Lii, Da-Yuan Shih | 2014-04-01 |
| 8618827 | Measurement of electrical and mechanical characteristics of low-K dielectric in a semiconductor device | Shih-Wei Liang, Ying-Ju Chen, Ching-Jung Yang, Hsien-Wei Chen, Hao-Yi Tsai +2 more | 2013-12-31 |
| 8610267 | Reducing delamination between an underfill and a buffer layer in a bond structure | Ching-Jung Yang, Chang-Pin Huang, Tzuan-Horng Liu, Michael Shou-Ming Tong, Ying-Ju Chen +3 more | 2013-12-17 |
| 8531032 | Thermally enhanced structure for multi-chip device | Chen-Hua Yu, Chih-Hang Tung | 2013-09-10 |
| 8476770 | Apparatus and methods for forming through vias | Chih-Hang Tung, Chen-Hua Yu, Hao-Yi Tsai, Mirng-Ji Lii, Da-Yuan Shih | 2013-07-02 |
| 8227822 | Light emitting diode apparatus | Chun-Chang Hung, Falcon Lin | 2012-07-24 |
| 7911556 | Backlight module having replaceable lamp module | Chi-Chun Yang, Ye-hen Chien | 2011-03-22 |
| 7821595 | Backlight module | Therm-Hoo Ke, Ying-Feng Hsu, Chi-Chun Yang, Li-Chuan Yu, Tzu-Yi Liu +2 more | 2010-10-26 |
| 7782418 | Backlight module | Therm-Hoo Ke, Ying-Feng Hsu, Chi-Chun Yang, Li-Chuan Yu, Tzu-Yi Liu +2 more | 2010-08-24 |
| 7581866 | Replaceable lamp module for liquid crystal display | Chi-Chun Yang, Ye-hen Chien | 2009-09-01 |
| 6387795 | Wafer-level packaging | — | 2002-05-14 |