Issued Patents All Time
Showing 26–50 of 74 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10985121 | Bump structure and fabricating method thereof | Chang-Pin Huang, Hsien-Ming Tu, Ching-Jung Yang, Yu-Chia Lai | 2021-04-20 |
| 10879198 | Package with solder regions aligned to recesses | Ching-Jung Yang, Hsien-Wei Chen, Hsien-Ming Tu, Chang-Pin Huang, Yu-Chia Lai | 2020-12-29 |
| 10854564 | Semiconductor device and manufacturing method thereof | Yu-Chia Lai, Hsien-Ming Tu, Chang-Pin Huang, Ching-Jung Yang | 2020-12-01 |
| 10854580 | Semiconductor structure along with multiple chips bonded through microbump and manufacturing method thereof | Wei-Heng Lin, Chih-Hang Tung, Chen-Hua Yu | 2020-12-01 |
| 10825804 | Hollow metal pillar packaging scheme | Chang-Pin Huang, Hsien-Ming Tu, Hsien-Wei Chen, Ching-Jung Yang, Yu-Chia Lai | 2020-11-03 |
| 10734348 | Bonded semiconductor devices and methods of forming the same | Chen-Hua Yu, Chih-Hang Tung | 2020-08-04 |
| 10468385 | Semiconductor structure including plurality of chips along with air gap and manufacturing method thereof | Wei-Heng Lin, Chih-Hang Tung, Chen-Hua Yu | 2019-11-05 |
| 10354986 | Hollow metal pillar packaging scheme | Chang-Pin Huang, Hsien-Ming Tu, Hsien-Wei Chen, Ching-Jung Yang, Yu-Chia Lai | 2019-07-16 |
| 10262958 | Package with solder regions aligned to recesses | Ching-Jung Yang, Hsien-Wei Chen, Hsien-Ming Tu, Chang-Pin Huang, Yu-Chia Lai | 2019-04-16 |
| 10229901 | Immersion interconnections for semiconductor devices and methods of manufacture thereof | Yi-Li Hsiao, Hsiao-Yun Chen, Chih-Hang Tung, Chen-Hua Yu | 2019-03-12 |
| 10163828 | Semiconductor device and fabricating method thereof | Chang-Pin Huang, Hsien-Ming Tu, Ching-Jung Yang, Yu-Chia Lai | 2018-12-25 |
| 10153218 | Semiconductor structure and manufacturing method thereof | Tsung-Yu Chen, Wensen Hung, Hung-Chi Li, Cheng-Chieh Hsieh, Chih-Hang Tung | 2018-12-11 |
| 10141291 | Semiconductor device and method of manufacturing the same | Chih-Hang Tung, Chen-Hua Yu | 2018-11-27 |
| 10068868 | Multi-strike process for bonding packages and the packages thereof | Chih-Hang Tung, Wen-Lin Shih, Hsiao-Yun Chen, Chen-Hua Yu | 2018-09-04 |
| 10032737 | Semiconductor device and manufacturing method thereof | Yu-Chia Lai, Hsien-Ming Tu, Chang-Pin Huang, Ching-Jung Yang | 2018-07-24 |
| 9997467 | Semiconductor packages and methods of forming the same | Chih-Hang Tung, Chen-Hua Yu | 2018-06-12 |
| 9947630 | Package with solder regions aligned to recesses | Ching-Jung Yang, Hsien-Wei Chen, Hsien-Ming Tu, Chang-Pin Huang, Yu-Chia Lai | 2018-04-17 |
| 9893046 | Thinning process using metal-assisted chemical etching | Su-Chun Yang, Yi-Li Hsiao, Chih-Hang Tung, Chen-Hua Yu | 2018-02-13 |
| 9812434 | Hollow metal pillar packaging scheme | Chang-Pin Huang, Hsien-Ming Tu, Hsien-Wei Chen, Ching-Jung Yang, Yu-Chia Lai | 2017-11-07 |
| 9786591 | Capacitor in post-passivation structures and methods of forming the same | Hao-Yi Tsai, Hsien-Wei Chen, Hung-Yi Kuo, Ying-Ju Chen, Tsung-Yuan Yu +1 more | 2017-10-10 |
| 9679883 | Hollow metal pillar packaging scheme | Chang-Pin Huang, Hsien-Ming Tu, Hsien-Wei Chen, Ching-Jung Yang, Yu-Chia Lai | 2017-06-13 |
| 9673270 | Metal insulator metal capacitor and method for making the same | Yu-Chia Lai, Ching-Jung Yang | 2017-06-06 |
| 9576929 | Multi-strike process for bonding | Chih-Hang Tung, Wen-Lin Shih, Hsiao-Yun Chen, Chen-Hua Yu | 2017-02-21 |
| 9559044 | Package with solder regions aligned to recesses | Ching-Jung Yang, Hsien-Wei Chen, Hsien-Ming Tu, Chang-Pin Huang, Yu-Chia Lai | 2017-01-31 |
| 9530715 | Thermally enhanced structure for multi-chip device | Chen-Hua Yu, Chih-Hang Tung | 2016-12-27 |